概述

户外狩猎相机用于对野生动物侦测时，光亮度进行补光拍照，图像传输通过WIFI 模块，方便读取数据。做出口需要通过FCC、CE、IC,日本，韩国等认证，自己做认证需要高额费用及较长的时间周期。红外热释电检测需要一个简单处理器，要求低功耗及低成本。本方案推荐的产品，可以满足上述严苛要求。

优势

· Silicon Labs的WIFI模块WGM110 ，优秀的RF性能指标，发射功率高达+16dBm,接收灵敏度高达-98dBm,通讯距离远达450m; 产品认证齐全，通过了FCC,CE,IC,日本，韩国认证，可减少认证时间和费用。

【WGM110】

Wizard Gecko WGM110 Wi-Fi® 模块

实现本地 IoT 连接的最简单途径

Wizard Gecko WGM110 是一种功能全面的 Wi-Fi 模块，专为需要满足良好射频性能、低功耗和快速上市时间等关键要求的应用而设计开发。WGM110 具有卓越的射频性能，并可提供远程范围的稳定无线连接和安全性。

WGM110 集成了 Wi-Fi IoT 所需要的所有要素，包括 802.11b/g/n 收音机、集成天线、认证、微控制器、Wi-Fi 和 IP 堆栈、HTTP 服务器以及 TCP 和 UDP 等多个协议。WGM110 可加载 BGScript 终端用户应用，或在搭配现有客户 MCU 的情况下在网络协处理器模式下运行。

WGM110 模块中包括高度灵活并支持多种外围设备和传感器的硬件接口。除 Wi-Fi 模块本身以外，Silicon Labs 还可指导和帮助开发人员使用 WGM110 来构建可快速上市的 IoT 应用。

模块优势

体积小并具有卓越射频性能：

同类最佳的模块尺寸

集成的高性能天线

低功耗

快速的上市时间：

板载 Wi-Fi 和软件堆栈

最低终端产品认证

全球应用工程支持

BGScript™ 独立应用：

在模块上运行应用

快速开发

无需外部 MCU

模块规格

收音机：

集成和外部天线型号

TX 电源：+16 dBm

TX 灵敏度：-98 dBm

Wi-Fi：

802.11：b/g/n

比特率：72.2 Mbps

802.11 安全：WPA2/WPA 个人、WPA2/WPA 企业和 WEP

STA(站点模式)

SoftAP(Soft AP 模式)：多达 5 个客户端

Wi-Fi 直连

WPS：1.0(按钮操作)

IP 堆栈：

IP 版本：IPv4

TCP：客户端/服务器

UDP：客户端/服务器

TCP Sockets：20+

DHCP：客户端/服务器

ARP

DNS：客户端/服务器

mDNS

DNS-SD

HTTP：服务器

TLS/SSL：客户端

MCU 功能

ARM® Cortex®-M3

48 MHz

128 kB RAM

1 MB 闪存

硬件接口：

主机接口：UART/SPI/USB

外围设备接口

2 x USART (UART/SPI)

1 x USB(2.0 全速)

2 x I2C 外围设备接口

多达 32 x 具中断功能的 GPIO

12-位 ADC

2 x 计时器(每个 3 PWM)

实时计数器

功耗：

261 mA TX 电流 @ +16 dBM

81 mA RX 电流

2.2 mA 相关闲置功耗

22 μA 深度睡眠电流

尺寸：

14.4 x 21.0 x 2.0 毫米

电气特性：

电源电压：2.7 V 至 4.8 V(无线块)

电源电压：1.98 V 至 3.8 V(处理器块)

软件 API：

用于调制解调器的 UART/SPI/USB BGAPI™ 串行协议 API

实施 BGAPI 串行协议的 BGLIB™ 主机 API

独立使用的 BGScript™ 脚本语言

开发软件工具：

免费 SDK

环境规格：

温度范围：-40°C 至 +85°C

模块认证(正在申请)：

CE

FCC

IC

日本

韩国

· Silicon Lab 的环境光检测传感器SI1141具有高精度，分辨率低至100mlx ;出厂校准，保证产品一致性 ;待机功耗低至500nA，适用于对电池工作的产品。

【Si1141/Si1142/Si1143】

PROXIMITY/AMBIENT LIGHT SENSOR IC WITH I2C INTERFACE

Features

> Integrated infrared proximity detector

》Proximity detection adjustable fromunder 1 cm up to 200 cm

》Three independent LED drivers

》15 current settings from 5.6 mA to360 mA for each LED driver

》25.6 µs LED driver pulse width

》50 cm proximity range with singlepulse (<3 klx)

》15 cm proximity range with singlepulse (>3 klx)

》Operates at up to 128 klx (directsunlight)

》High reflectance sensitivity< 1 µW/cm2

》High EMI immunity without shieldedpackaging

> Integrated ambient light sensor

》100 mlx resolution possible,allowing operation under dark glass

》1 to 128 klx dynamic range possibleacross two ADC range settings

》Accurate lux measurements with IRcorrection algorithm

> Industry's lowest power consumption

》1.71 to 3.6 V supply voltage

》9 µA average current (LED pulsed25.6 µs every 800 ms at 180 mAplus 3 µA Si114x supply)

》< 500 nA standby current

》25.6 µs LED “on” time keeps totalpower consumption duty cycle lowwithout compromising performanceor noise immunity

》Internal and external wake support

》Built-in voltage supply monitor andpower-on reset controller

> Serial communications

》Up to 3.4 Mbps data rate

》Slave mode hardware addressdecoding (0x5A)

> Small-outline 10-lead 2x2 mm QFN

> Temperature Range

》–40 to +85 °C

Applications

> Handsets

> Heart rate monitoring

> Pulse oximetry

> Wearables

> Audio products

> Security panels

> Tamper detection circuits

> Dispensers

> Valve controls

> Smoke detectors

> Touchless switches

> Touchless sliders

> Occupancy sensors

> Consumer electronics

> Industrial automation

> Display backlighting control

> Photo-interrupters

Description

The Si1141/42/43 is a low-power, reflectance-based, infrared proximity and ambientlight sensor with I2C digital interface and programmable-event interrupt output. Thistouchless sensor IC includes an analog-to-digital converter, integrated highsensitivityvisible and infrared photodiodes, digital signal processor, and one, two, orthree integrated infrared LED drivers with fifteen selectable drive levels. The Si1141/42/43 offers excellent performance under a wide dynamic range and a variety of lightsources including direct sunlight. The Si1141/42/43 can also work under dark glasscovers. The photodiode response and associated digital conversion circuitry provideexcellent immunity to artificial light flicker noise and natural light flutter noise. Withtwo or more LEDs, the Si1142/43 is capable of supporting multiple-axis proximitymotion detection. The Si1141/42/43 devices are provided in a 10-lead 2x2 mm QFNpackage and are capable of operation from 1.71 to 3.6 V over the –40 to +85 °Ctemperature range.

· Silicon Labs EFM8SB10F8 单片机，低工作电流(150uA/MHz at 24.5MHz)，低待机电流(1uA),快速唤醒时间(<2us);价格低，适合低成本设计。　

【EFM8SB1】

EFM8 Sleepy Bee Family EFM8SB1 Data Sheet

The EFM8SB1, part of the Sleepy Bee family of MCUs, is the world’s most energy friendly 8-bit microcontrollers with a comprehensive feature set in small packages.

These devices offer lowest power consumption by combining innovative low energy techniques and short wakeup times from energy saving modes into small packages, making them well-suited for any battery operated applications. With an efficient 8051 core, 14 high-quality capacitive sense channels, and precision analog, the EFM8SB1 family is also optimal for embedded applications.

EFM8SB1 applications include the following:

• Touch pads / key pads

• Wearables

• Instrumentation panels

• Battery-operated consumer electronics

ENERGY FRIENDLY FEATURES

• Lowest MCU sleep current with supplybrownout (50 nA)

• Lowest MCU active current (150 μA / MHzat 24.5 MHz)

• Lowest MCU wake on touch averagecurrent (< 1 μA)

• Lowest sleep current using internal RTCand supply brownout (< 300 nA)

• Ultra-fast wake up for digital and analogperipherals (< 2 μs)

• Integrated LDO to maintain ultra-lowactive current at all voltages

Feature List

The EFM8SB1 highlighted features are listed below.

• Core:

• Pipelined CIP-51 Core

• Fully compatible with standard 8051 instruction set

• 70% of instructions execute in 1-2 clock cycles

• 25 MHz maximum operating frequency

• Memory:

• Up to 8 kB flash memory, in-system re-programmable from firmware.

• Up to 512 bytes RAM (including 256 bytes standard 8051 RAM and 256 bytes on-chip XRAM)

• Power:

• Internal LDO regulator for CPU core voltage

• Power-on reset circuit and brownout detectors

• I/O: Up to 17 total multifunction I/O pins:

• Flexible peripheral crossbar for peripheral routing

• 5 mA source, 12.5 mA sink allows direct drive of LEDs

• Clock Sources:

• Internal 20 MHz low power oscillator with ±10% accuracy

• Internal 24.5 MHz precision oscillator with ±2% accuracy

• Internal 16.4 kHz low-frequency oscillator or RTC 32 kHz crystal (RTC crystal not available on CSP16 packages)

• External crystal, RC, C, and CMOS clock options

• Timers/Counters and PWM:

• 32-bit Real Time Clock (RTC)

• 3-channel Programmable Counter Array (PCA) supporting PWM, capture/compare, and frequency output modes with watchdog timer function

• 4 x 16-bit general-purpose timers

• Communications and Digital Peripherals:

• UART

• SPI™ Master / Slave

• SMBus™ / I2C™ Master / Slave

• 16-bit CRC unit, supporting automatic CRC of flash at 256-byte boundaries

• Analog:

• Capacitive Sense (CS0)

• Programmable current reference (IREF0)

• 12-Bit Analog-to-Digital Converter (ADC0)

• 1 x Low-current analog comparator

• On-Chip, Non-Intrusive Debugging

• Full memory and register inspection

• Four hardware breakpoints, single-stepping

• Pre-loaded UART bootloader

• Temperature range -40 to 85 ºC

• Single power supply 1.8 to 3.6 V

• QSOP24, QFN24, QFN20, and CSP16 packages

With on-chip power-on reset, voltage supply monitor, watchdog timer, and clock oscillator, the EFM8SB1 devices are truly standalone system-on-a-chip solutions. The flash memory is reprogrammable in-circuit, providing non-volatile data storage and allowing field upgrades of the firmware. The on-chip debugging interface (C2) allows non-intrusive (uses no on-chip resources), full speed, in-circuit debugging using the production MCU installed in the final application. This debug logic supports inspection and modification of memory and registers, setting breakpoints, single stepping, and run and halt commands. All analog and digital peripherals are fully functional while debugging. Each device is specified for 1.8 to 3.6 V operation. Devices are AEC-Q100 qualified (Grade 3) and are available in 16- pin CSP, 20-pin QFN, 24-pin QFN, or 24-pin QSOP packages. All package options are lead-free and RoHS compliant. Note: CSP devices can be handled and soldered using industry standard surface mount assembly techniques. However, because CSP devices are essentially a piece of silicon and are not encapsulated in plastic, they are susceptible to mechanical damage and may be sensitive to light. When CSP packages must be used in an environment exposed to light, it may be necessary to cover the top and sides with an opaque material.