原标题：基于MSP430+CC256x的智能蓝牙驱动电路设计方案

　　TICC256x器件是一款完整的蓝牙BR/EDR/LEHCI 解决方案，此解决方案减轻了设计工作并可实现快速上市。基于TI 的第七代蓝牙内核，器件实现了已经证明的解决方案，此解决方案支持蓝牙4.0 双模式(BR/EDR/LE)协议。TI 的电源管理硬件和软件算法大大节省了所有广泛使用的蓝牙BR/EDR/LE模式运行的能耗。当与一个MCU 器件耦合时，这个HCI 器件为以下应用提供业界最佳的RF 性能：手机附件， 体育和健身应用，无线音频解决方案。

　　显示了CC256x设备参考示意图。TI的完整电路图和PCB布局的指导方针。

　　借助于传输功率和接收敏感度，相对于其它只支持BLE 的解决方案，这个解决方案提供大约2 倍的业界最佳范围。TI 提供的一款无版权软件蓝牙堆栈被与TI MSP430 和Stellaris MCU 预先集成在一起。TI 的合作伙伴Stonestreet One 也通过MFi 解决方案和其它MCU 提供此堆栈。目前支持的一些配置包括：串行端口配置(SPP)， 高级音频分配配置(A2DP)，几个BLE 配置(根据支持的MCU，这些配置会发生变化)。

　　CC2560B

　　CC256x 蓝牙和双模控制器

　　描述

　　The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

　　The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

　　Serial port profile (SPP)

　　Advanced audio distribution profile (A2DP)

　　Audio/video remote control profile (AVRCP)

　　Handsfree profile (HFP)

　　Human interface device (HID)

　　Generic attribute profile (GATT)

　　Several Bluetooth LE profiles and services

　　In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

　　特性

　　TI’s Single-Chip Bluetooth Solution With Bluetooth

　　Basic Rate (BR), Enhanced Data Rate (EDR), and

　　Low Energy (LE) Support; Available in Two

　　Variants:

　　Dual-Mode Bluetooth CC2564 Controller

　　Bluetooth CC2560 Controller

　　CC2564 Bluetooth 4.1 Controller Subsystem

　　Qualified (QDID 58852); Compliant up to the HCI

　　Layer

　　Highly Optimized for Low-Cost Designs:

　　Single-Ended 50-Ω RF Interface

　　Package Footprint: 76 Terminals, 0.6-mm Pitch,

　　8-mm x 8-mm mrQFN

　　BR/EDR Features Include:

　　Up to 7 Active Devices

　　Scatternet: Up to 3 Piconets Simultaneously, 1

　　as Master and 2 as Slaves

　　Up to 2 SCO Links on the Same Piconet

　　Support for All Voice Air-Coding – Continuously

　　Variable Slope Delta (CVSD), A-Law, µ-Law,

　　and Transparent (Uncoded)

　　CC2560B/CC2564B Devices Provide an

　　Assisted Mode for HFP 1.6 Wideband Speech

　　(WBS) Profile or A2DP Profile to Reduce Host

　　Processing and Power

　　Support of Multiple Bluetooth Profiles With

　　Enhanced QoS

　　LE Features Include:

　　Support of Up to 10 (CC2564B) Connections

　　Multiple Sniff Instances Tightly Coupled to

　　Achieve Minimum Power Consumption

　　Independent Buffering for LE Allows Large

　　Numbers of Multiple Connections Without

　　Affecting BR/EDR Performance.

　　Built-In Coexistence and Prioritization Handling

　　for BR/EDR and LE

　　Best-in-Class Bluetooth (RF) Performance

　　(TX Power, RX Sensitivity, Blocking)

　　Class 1 TX Power Up to +10 dBm

　　–95 dbm Typical RX Sensitivity

　　Internal Temperature Detection and

　　Compensation to Ensure Minimal Variation in

　　RF Performance Over Temperature, No

　　External Calibration Required

　　Improved Adaptive Frequency Hopping (AFH)

　　Algorithm With Minimum Adaptation Time

　　Provides Longer Range, Including 2x Range

　　Over Other LE-Only Solutions

　　Advanced Power Management for Extended

　　Battery Life and Ease of Design

　　On-Chip Power Management, Including Direct

　　Connection to Battery

　　Low Power Consumption for Active, Standby,

　　and Scan Bluetooth Modes

　　Shutdown and Sleep Modes to Minimize Power

　　Consumption

　　Physical Interfaces:

　　UART Interface With Support for Maximum

　　Bluetooth Data Rates

　　UART Transport Layer (H4) With Maximum

　　Rate of 4 Mbps

　　Three-Wire UART Transport Layer (H5) With

　　Maximum Rate of 4 Mbps (CC2560B and

　　CC2564B Only)

　　Fully Programmable Digital PCM-I2S Codec

　　Interface

　　Flexibility for Easy Stack Integration and Validation

　　Into Various Microcontrollers, Such as MSP430™

　　and ARM® Cortex®-M3 and Cortex®-M4 MCUs

　　CC256x Bluetooth Hardware Evaluation Tool: PC-

　　Based Application to Evaluate RF Performance of

　　the Device and Configure Service Pack

　　Device Pin-to-Pin Compatible With Previous

　　Devices or Modules