原标题：大联大品佳集团力推基于Microchip产品的蓝牙智能门锁解决方案

　　2017年6月15日，致力于亚太地区市场的领先半导体元器件分销商---大联大控股宣布，其旗下品佳推出基于微芯科技(Microchip)ATSAMB11的BLE智能门锁方案，支持蓝牙、触摸解锁以及指纹识别功能。

　　图示1-大联大品佳推出基于Microchip蓝牙ATSAMB11的智能门锁方案功能框图

　　近年来，智能家居逐渐走进普通老百姓生活，也正因为这些行业的兴起，对无线传输技术要求越来越高，比如Wi-Fi、蓝牙、ZigBee、LoRa、NB IoT等等。由于低功耗以及多点链接，Mesh网络的应用需求，蓝牙的优势也逐步显现，特别是蓝牙4.0 BLE以及组网环境。以智能门锁，智能调光灯等为代表的BLE传输应用的也越来越多。

　　大联大品佳推出的基于Microchip蓝牙ATSAMB11的智能门锁方案，可通过APP实现开关门锁，该方案还支持指纹识别和触摸滑动功能。

　　图示2-大联大品佳推出基于Microchip蓝牙ATSAMB11的智能门锁方案首版样机照片

　　方案特点

　　• +4.2V/2A锂电池输入;

　　• 支持蓝牙功能;

　　• 支持触摸解锁;

　　• 支持指纹识别;

　　• 工作环境：-40℃--+85℃。

　　重要特征

　　• 芯片内部集成MCU，并且flash支持256KB，SRAM 128KB，ROM 128KB。支持 AES-128，SHA-256算法，支持SPI，UART，ADC，PWM等外设资源。

　　• Bluetooth部分支持BLE并且硬件支持BT4.1

　　• 芯片内部集成PMU单元

　　• 支持手机APP更新固件程序

　　Features:

　　Lowest BLE power consumption in industry

　　ARM Cortex-M0 with 128KB RAM, 256KB flash

　　Small package format: QFN (48pin 6x6 mm)

　　Optimized system cost - High level of integration on chip reduces external Bill of Material significantly

　　Wide operating voltage range: 2.3 – 3.6V

　　RoHS compliant

　　The ATSAMB11 is an ultra-low power Bluetooth® Low Energy System on a Chip with Integrated MCU, Transceiver, Modem, MAC, PA, TR Switch, and Power Management Unit (PMU). It is a standalone ARM® Cortex®-M0 applications processor with embedded Flash memory and BLE connectivity.

　　The qualified Bluetooth Low Energy protocol stack is stored in dedicated ROM, and the firmware includes L2CAP service layer protocols, Security Manager, Attribute protocol (ATT), Generic Attribute Profile (GATT) and the Generic Access Profile (GAP). Additionally, application profiles such as Proximity, Thermometer, Heart Rate, Blood Pressure, and many others are supported and included in the protocol stack.

　　The ATSAMB11 is available in a QFN package or as a certified module. The fully-certified ATSAMB11-MR210CA module is available now for purchase.

　　For product comparison, please consider: ATSAMB11-ZR

　　Additional Features

　　Lowest BLE power consumption in industry

　　ARM Cortex-M0 with 128KB RAM, 256KB flash

　　Small package format: QFN (48pin 6x6 mm)

　　Optimized system cost - High level of integration on chip reduces external Bill of Material significantly

　　Wide operating voltage range: 2.3 – 3.6V

　　RoHS compliant

　　Available in a fully-certified module package: ATSAMB11-MR210CA

　　Compliant to Bluetooth Low Energy 4.2 SIG core specification

　　ATSAMB11-ZR

　　Features:

　　Microchip''s lowest BLE power consumption in a module

　　ARM Cortex-M0 with 128KB RAM, 256KB flash

　　Optimized system cost - High level of integration on chip reduces external Bill of Material significantly

　　Wide operating voltage range: 2.3 – 3.6V

　　Smart Connect Mobile App with source code available

　　Compliant to Bluetooth Low Energy 4.2 SIG core specification

　　Summary

　　The ATSAMB11-ZR is an ultra-low power, fully certified Bluetooth® Low Energy module with Integrated ARM® Cortex®-M0 MCU and application Flash memory.

　　BluSDK Smart supports application profiles such as Proximity, Thermometer, Heart Rate, Blood Pressure, and many others.

　　The qualified Bluetooth Low Energy protocol stack is stored in dedicated ROM, and the firmware includes L2CAP service layer protocols, Security Manager, Attribute protocol (ATT), Generic Attribute Profile (GATT) and the Generic Access Profile (GAP).

　　Additional Features

　　Microchip's lowest BLE power consumption in a module

　　ARM Cortex-M0 with 128KB RAM, 256KB flash

　　Optimized system cost - High level of integration on chip reduces external Bill of Material significantly

　　Wide operating voltage range: 2.3 – 3.6V

　　Smart Connect Mobile App with source code available

　　Compliant to Bluetooth Low Energy 4.2 SIG core specification