原标题：ST ISM330DHCXiNEMO惯性模块工业4．0应用方案

　　ST公司的ISM330DHCX是系统级封装 iNEMO惯性模块,具有机器学习内核,有限状态机(FSM)和数字输出.器件具有高性能3D数字加速度计和3D数字陀螺仪,特别为工业4.0应用而设计.ST公司的各种传感器元件采用特别的微机电技术制造,而IC接口采用CMOS技术,使得专用电路的设计能更好地和传感元件特性更好地匹配.ISM330DHCX 全范围加速度范围为±2/±4/±8/±16g,而角速率范围为±125/±250/±500/±1000/ ±2000/±4000dps,使得器件有广泛的应用.ISM330DHCX无与伦比的嵌入特性(机器学习核,可编FSM,FIFO,传感器集线器,事件译码和中断)可以实现智能和复杂的传感器节点,以非常低的功耗提供高性能. ISM330DHCX采用14引脚LGA封装.模拟工作电压1.71 V到3.6 V,工作温度-40 到 +105 ℃ .主要用在工业IoT和连接设备,天线,平台,光学图像和透镜稳定.机器人,无线机和工业自动化,导航系统和远程信息处理,以及震动监视和补偿.中电网为您整理如下详细资料,本文介绍了ISM330DHCX主要特性,滤波器框图,加速度计复合滤波器框图,Mode 1/2/3&4的ISM330DHCX电连接图,加速度计框图以及评估板STEVAL-MKI210V1K主要特性,电路图和材料清单.

　　The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.

　　The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.

　　ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

　　The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

　　In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.

　　The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.

　　All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.

　　An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power. The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.

　　ISM330DHCX主要特性:

　　3D accelerometer with selectable full scale: ±2/±4/±8/±16 g

　　3D gyroscope with extended selectable full scale: ±125/±250/±500/±1000/±2000/±4000 dps

　　Extended temperature range from -40 to +105 ℃

　　Embedded compensation for high stability over temperature

　　SPI/I²C serial interface

　　Auxiliary SPI serial interface for data output of gyroscope and accelerometer (OIS and other stabilization applications)

　　Six-channel synchronized output

　　Sensor hub feature to efficiently collect data from additional external sensors

　　Embedded smart FIFO up to 9 kbytes

　　Programmable Finite State Machine to process data from accelerometer, gyroscope, and external sensors Machine Learning Core

　　Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click

　　Embedded pedometer, step detector and counter for healthcare applications

　　Analog supply voltage: 1.71 V to 3.6 V

　　Embedded temperature sensor

　　Embedded self-test both for gyroscope and accelerometer

　　High shock survivability

　　ECOPACK, RoHS and “Green” compliant

　　ISM330DHCX应用:

　　Industrial IoT and connected devices

　　Antennas, platforms, and optical image and lens stabilization

　　Robotics, drones and industrial automation

　　Navigation systems and telematics

　　Vibration monitoring and compensation

　　ISM330DHCX片上特性:

　　9 kbytes data buffering, data can be compressed two or three times

　　– 100% efficiency with flexible configurations and partitioning

　　– Possibility to store timestamp

　　Event-detection interrupts (fully configurable):

　　– Free-fall

　　– Wakeup

　　– 6D orientation

　　– Click and double-click sensing

　　– Activity/inactivity recognition

　　– Stationary/Motion detection

　　Specific IP blocks with negligible power consumption and high-performance:

　　– Finite State Machine (FSM) for accelerometer, gyroscope, and external sensors

　　– Machine Learning Core (MLC)

　　– Significant Motion Detection, tilt, pedometer, step detector and step counters

　　Sensor hub

　　– Up to 6 total sensors: 2 internal (accelerometer and gyroscope) and 4 external sensors

　　图1.滤波器框图

　　图2.加速度计复合滤波器框图

　　图3.Mode 1的ISM330DHCX电连接图

　　图4.Mode 2的ISM330DHCX电连接图

　　图5.Mode 3和Mode 4的ISM330DHCX电连接图

　　图6.加速度计框图

　　评估板STEVAL-MKI210V1K

　　iNemo inertial module kit based on ISM330DHCX

　　The STEVAL-MKI210V1 evaluation board has an embedded ISM330DHCX 3D accelerometer and 3D gyroscope sensor, which is connected through flat cable to a simple adapter board (STEVAL-MKIGIBV2) to render it compatible with STEVALMKI109V3.

　　The sensor is soldered precisely in the center of the board and double-sidedadhesives are provided to allow users to conveniently mount the board on equipmentdestined for vibration analysis. Alternatively, you can mount the board using the holeslocated in each corner of the PCB.

　　The STEVAL-MKIGIBV2 can be plugged into a standard DIL 24 socket. The kitprovides the complete IIS3DWB pin-out and comes ready-to-use with the requireddecoupling capacitors on the VDD power supply line.

　　This adapter is supported by the STEVAL-MKI109V3 motherboard with highperformance 32-bit microcontroller functioning as a bridge between the sensor and aPC, on which it is possible to use the downloadable graphical user interface (UnicoGUI), or dedicated software routines for customized applications.

　　评估板STEVAL-MKI210V1K主要特性:

　　• User friendly ISM330DHCX board

　　• Complete ISM330DHCX pinout for a standard DIL 24 socket

　　• Double-sided adhesives included for easy mounting on equipment to bemeasured

　　• Fully compatible with and STEVAL-MKI109V3 motherboard

　　• RoHS compliant

　　图7.评估板STEVAL-MKI210V1K外形图

　　图8.评估板STEVAL-MKI210V1电路图

　　图9.评估板STEVAL-MKI210V2电路图