原标题：Fairchild FSBB30CH60D 3kW三相马达逆变器参考设计

　　Fairchild公司的FSBB30CH60D是Motion SPM® 3模块,提供交流马达,BLDC和PMSM马达的全特性高性能逆变器输出级.模块集成了内置IGBT优化了的栅极驱动,以降低EMI和损耗,同时提供多种保护特性,包括欠压锁住,过流关断,驱动IC的热监测和故障报告.主要用于家用电器和工业马达驱动.本文介绍了FSBB30CH60D主要特性,框图,典型应用电路,以及3kW/220VAc和30A/600V 3相IGBT逆变器参考计的主要特性和指标,设计框图,电路图和PCB布局图.

　　FSBB30CH60D is an advanced Motion SPM® 3 module providing a fully-featured, high-performance inverter output stage for AC Induction, BLDC, and PMSM motors. These modules integrate optimized gate drive of the built-in IGBTs to minimize EMI and losses, while also providing multiple on-module protection features including under-voltage lockouts, over-current shutdown, thermal monitoring of drive IC, and fault reporting. The built-in, high-speed HVIC requires only a single supply voltage and translates the incoming logic-level gate inputs to the high-voltage, high-current drive signals required to properly drive the module’s internal IGBTs.

　　Separate negative IGBT terminals are available for each phase to support the widest variety of control algorithms.

　　FSBB30CH60D主要特性:

　　• UL Certified No. E209204 (UL1557)

　　• 600 V - 30 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection

　　• Low-Loss, Short-Circuit Rated IGBTs

　　• Very Low Thermal Resistance Using Al2O3 DBCSubstrate

　　• Built-In Bootstrap Diodes and Dedicated Vs PinsSimplify PCB Layout

　　• Separate Open-Emitter Pins from Low-Side IGBTs for Three-Phase Current Sensing

　　• Single-Grounded Power Supply

　　• LVIC Temperature-Sensing Built-In for Temperature Monitoring

　　• Isolation Rating: 2500 Vrms/1 min.

　　FSBB30CH60D应用:

　　• Motion Control - Home Appliance/Industrial Motor

　　图1. FSBB30CH60D内部框图

　　SPM3 FSBB30CH60D马达驱动参考设计

　　The SPM3 design objective is to provide a minimized package and a low power consumption module with improved reliability. This is achieved by applying new gate-driving high-voltage integrated circuit (HVIC), a new insulated-gate bipolar transistor (IGBT) of advanced silicon technology, and improved direct bonded copper (DBC) substrate base transfer mold package. Motion SPM 3 achieves reduced board size and improved reliability compared to existing discrete solutions. Target applications are inverterized motor drives for industrial use, such as air conditioners, general-purpose inverters and serve motors.

　　The temperature sensing function of SPM3 version 5 products is implemented in the LVIC to enhance the system reliability. An analog voltage proportional to the temperature of the LVIC is provided for monitoring the module temperature and necessary protections against over-temperature situations. Figure 1 show the package outline structure.

　　SPM3 FSBB30CH60D马达驱动参考设计主要特性:

　　 600 V 15 A / 20 A / 30 A 3-Phase IGBT Inverter Including Control ICs for Gate Driving and Protections

　　 Very Low Thermal Resistance by Adopting DBC Substrate

　　 Easy PCB Layout due to Built-in Bootstrap Diodes

　　 Divided Negative DC-Link Terminals for Inverter Three-Leg Current Sensing

　　 Single-Grounded Power Supply due to Built-in HVICs and Bootstrap Operations

　　 Built-in Temperature Sensing Unit of IC

　　 Isolation Rating of 2500 VRMS/min

　　SPM3 FSBB30CH60D马达驱动参考设计主要指标:

　　图SPM3 FSBB30CH60D马达驱动参考设计PCB布局图