核心板:MSM8953模块(2+16GB配置版)
原标题:MSM8953 模块(2+16GB配置版)
板卡类型:核心板
方案概述
MSM8953 模块(2+16GB配置版),详细参数:
模块实物图:
【MSM8953】
Snapdragon 600 series high-tier platforms are designed to support a high-value combination of advanced features, leading performance, robust connectivity and all-day battery life in leading devices.
The Qualcomm® Snapdragon™ 625 mobile platform uses leading-edge 14 nm technology to power premium experiences in high-tier smartphones without draining the battery. With features like support for full HD+ (1080p), an integrated Qualcomm® Snapdragon™ X9 LTE modem, and Qualcomm® Adreno™ 506 PC-class graphics, the Snapdragon 625 is designed ....
Battery life that goes the distance
Devices require less frequent charging thanks to a low-power Cortex A53 processor and efficiency-boosting features like universal bandwidth compression.
Don't miss a pixel
The Snapdragon 625's dual ISP supports rich detail for photos, in addition to an expansive set of camera features, like gyro image stabilization and enhanced autofocus.
More powerful processing
An integrated Adreno 506 series GPU delivers processing power for dazzling displays.
4K Ultra HD video
Premium 4K video with HEVC capture and playback for optimal balance of quality and bandwidth.
Integrated X9 LTE
Up to 3x the LTE upload speeds of most LTE devices - up to 150 Mbps, and advanced Wi-Fi with MU-MIMO - for super-fast sharing of high res photos and videos.
Less time charging
Qualcomm® Quick Charge™ 3.0 is up to four times as fast as conventional charging and is 38% more efficient than Quick Charge 2.0. Spend less time charging and more time doing.
Features
Integrated X9 LTE
Cat 7 downlink, up to 300 Mbps
Cat 13 uplink, up to 150 Mbps
2x20Mz carrier aggregation with up to 64-QAM
Snapdragon All Mode
Ultra HD Voice with EVS codec
Qualcomm® TruSignal™ Antenna Boost
Professional camera features and DSLR-like image quality with dual image signal processors
Qualcomm® Hexagon™ 546 DSP provides battery-efficient enhancements to audio, video, and computer vision use cases
Qualcomm® Adreno™ 506 PC-class graphics with support for advanced APIs and Hardware Tessellation
Snapdragon sensor core supports new always-on use cases at reduced power levels and cost
Software leveragable across other Snapdragon 600 series processors
Specifications
CPU
CPU Clock Speed: Up to 2.0 GHz
CPU Cores: Octa-core CPU, 8x ARM Cortex A53
CPU Bit Architecture: 64-bit
Process
Process Technology: 14 nm LPP
DSP
DSP Technology: Qualcomm® Hexagon™ DSP, Qualcomm All-Ways Aware™ technology
Cellular Modem
Modem Name: Qualcomm® Snapdragon™ X9 LTE modem
Multi SIM: LTE Dual SIM
Next-generation Calling Services: VoLTE with SRVCC to 3G and 2G, Voice over Wi-Fi (VoWiFi) with LTE call continuity, HD and Ultra HD Voice (EVS)
LTE Category
Uplink LTE Category: LTE Category 13 (uplink)
Downlink LTE Category: LTE Category 7 (downlink)
LTE Downlink Features
Downlink Carrier Aggregation: 2x20 MHz carrier aggregation
Downlink QAM: Up to 64-QAM
LTE Uplink Features
Uplink Technology: Qualcomm® Snapdragon™ Upload+
Uplink Carrier Aggregation: 2x20 MHz carrier aggregation
Uplink QAM: Up to 64-QAM
LTE Speed
LTE Peak Download Speed: 300 Mbps
LTE Peak Upload Speed: 150 Mbps
Cellular Technology
LTE Technology: Qualcomm® Snapdragon™ All Mode, LTE FDD, LTE TDD, LTE Broadcast
Cellular Technology: WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
Wi-Fi
Wi-Fi Standards: 802.11ac Wave 2, 802.11a/b/g, 802.11n
Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz
Peak speed: 433 Mbps
Channel Utilization: 20/40/80 MHz
MIMO Configuration: 1x1 (1-stream)
Peak QAM: 256 QAM
Wi-Fi Features: MU-MIMO, Integrated baseband
Bluetooth
Bluetooth Version: Bluetooth 4.1
Bluetooth Technology: Bluetooth Low Energy
Location
Advanced Location Features: Low Power Geofencing and Tracking, Sensor-assisted Navigation, Pedestrian Navigation
Global Emergency Services Support: Assisted GPS, OTDOA (LTE-based positioning)
Location Support: Qualcomm® Location
Satellite Systems Support: GPS, GLONASS, Beidou, Galileo
NFC
Near Field Communications: Supported
RF
RFFE: Qualcomm® RF Front-End solution
USB
USB Version: USB 3.0
Camera
Megapixel Support: Up to 24 MP camera
Image Signal Processor: 2x Image Signal Processor (ISP)
Video
Video Capture: Up to 4K Ultra HD video capture @ 30FPS
Video Playback: Up to 4K Ultra HD video playback
Codec Support: H.265 (HEVC), H.264 (AVC)
Display
Maximum On-Device Display Support: FHD+, 1080p Full HD, 1900x1200, WUXGA
UI FPS: Up to 60 FPS
General Audio
Audio Technology: Qualcomm® Fluence™ HD noise cancellation technology
GPU
GPU Name: Qualcomm® Adreno™ 506 GPU
API Support: OpenGL ES 3.1+
Charging
Qualcomm® Quick Charge™ Support: Qualcomm® Quick Charge™ 3.0 technology
Security Support
Security Features: Qualcomm® Processor Security, Qualcomm® Content Protection, Qualcomm® Device Lock Authentication
Memory
Memory speed: 933MHz
Memory Type: LPDDR3
Storage
eMMC: eMMC 5.1
SD: SD 3.0 (SDCC)
Part
Part Numbers: 8953
msm8953 pro是什么处理器
高通msm8953 Pro也就是msm8953的升级版,msm8953命名为骁龙625,msm8953 pro是高通去年新发布的骁龙626处理器。作为升级版,骁龙626主要在性能方面有所提升,其余大部分规格与骁龙625基本相同。
骁龙626代号MSM8953Pro,也是625的升级版,主频从2GHz提升到2.2GHz,基带升级为LTEX9,支持蓝牙4.2,其他参数基本一致,采用14nm制程,支持QC3.0快充。
骁龙626是八核A53架构,由于A53是低性能低功耗的核心,加上14纳米工艺制造,可更好的降低发热量,节约手机电量。骁龙625目前在千元市场广受用户欢迎,也是得益于超长续航的特性,在性能已经足够的条件下,采用低功耗方案设计来延长手机续航时间,这才是打动用户选择的根本。
去年底高通发布的新款高端芯片骁龙820正是采用三星的14nmFinFET工艺生产。不过三星的产能显然不足够,导致骁龙820在广受市场欢迎的情况下面临缺货,中国手机企业转而纷纷采用高通的骁龙65X或联发科的芯片,在这样的情况下高通选择了同时在台积电和三星两家半导体工厂下单,确保产能。
这种平衡分配的方式显然不合理,上一款的芯片骁龙652/骁龙650采用台积电的28nm生产,而定位比它稍低的骁龙625却选择了三星的14nmFinFET工艺生产,最终中国手机企业考虑到功耗和成本等问题有相当多的手机企业反而选择了定位稍低的骁龙625而不是采用它的中高端芯片骁龙652/骁龙650。
msm8953 Pro 骁龙626很显然是今年的中端主打产品,目前已经有三星C7 Pro、三星C5 Pro采用了骁龙626,此外锤子坚果Pro、OPPO、Vivo等也对这款芯片很看好,估计今年的骁龙626又一次如骁龙625一样广受欢迎。
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