原标题：MSM8953 模块(2+16GB配置版)

　　板卡类型：核心板

　　方案概述

　　MSM8953 模块(2+16GB配置版)，详细参数：

　　模块实物图：

　　【MSM8953】

　　Snapdragon 600 series high-tier platforms are designed to support a high-value combination of advanced features, leading performance, robust connectivity and all-day battery life in leading devices.

　　The Qualcomm® Snapdragon™ 625 mobile platform uses leading-edge 14 nm technology to power premium experiences in high-tier smartphones without draining the battery. With features like support for full HD+ (1080p), an integrated Qualcomm® Snapdragon™ X9 LTE modem, and Qualcomm® Adreno™ 506 PC-class graphics, the Snapdragon 625 is designed ....

　　Battery life that goes the distance

　　Devices require less frequent charging thanks to a low-power Cortex A53 processor and efficiency-boosting features like universal bandwidth compression.

　　Don't miss a pixel

　　The Snapdragon 625's dual ISP supports rich detail for photos, in addition to an expansive set of camera features, like gyro image stabilization and enhanced autofocus.

　　More powerful processing

　　An integrated Adreno 506 series GPU delivers processing power for dazzling displays.

　　4K Ultra HD video

　　Premium 4K video with HEVC capture and playback for optimal balance of quality and bandwidth.

　　Integrated X9 LTE

　　Up to 3x the LTE upload speeds of most LTE devices - up to 150 Mbps, and advanced Wi-Fi with MU-MIMO - for super-fast sharing of high res photos and videos.

　　Less time charging

　　Qualcomm® Quick Charge™ 3.0 is up to four times as fast as conventional charging and is 38% more efficient than Quick Charge 2.0. Spend less time charging and more time doing.

　　Features

　　Integrated X9 LTE

　　Cat 7 downlink, up to 300 Mbps

　　Cat 13 uplink, up to 150 Mbps

　　2x20Mz carrier aggregation with up to 64-QAM

　　Snapdragon All Mode

　　Ultra HD Voice with EVS codec

　　Qualcomm® TruSignal™ Antenna Boost

　　Professional camera features and DSLR-like image quality with dual image signal processors

　　Qualcomm® Hexagon™ 546 DSP provides battery-efficient enhancements to audio, video, and computer vision use cases

　　Qualcomm® Adreno™ 506 PC-class graphics with support for advanced APIs and Hardware Tessellation

　　Snapdragon sensor core supports new always-on use cases at reduced power levels and cost

　　Software leveragable across other Snapdragon 600 series processors

　　Specifications

　　CPU

　　CPU Clock Speed: Up to 2.0 GHz

　　CPU Cores: Octa-core CPU, 8x ARM Cortex A53

　　CPU Bit Architecture: 64-bit

　　Process

　　Process Technology: 14 nm LPP

　　DSP

　　DSP Technology: Qualcomm® Hexagon™ DSP, Qualcomm All-Ways Aware™ technology

　　Cellular Modem

　　Modem Name: Qualcomm® Snapdragon™ X9 LTE modem

　　Multi SIM: LTE Dual SIM

　　Next-generation Calling Services: VoLTE with SRVCC to 3G and 2G, Voice over Wi-Fi (VoWiFi) with LTE call continuity, HD and Ultra HD Voice (EVS)

　　LTE Category

　　Uplink LTE Category: LTE Category 13 (uplink)

　　Downlink LTE Category: LTE Category 7 (downlink)

　　LTE Downlink Features

　　Downlink Carrier Aggregation: 2x20 MHz carrier aggregation

　　Downlink QAM: Up to 64-QAM

　　LTE Uplink Features

　　Uplink Technology: Qualcomm® Snapdragon™ Upload+

　　Uplink Carrier Aggregation: 2x20 MHz carrier aggregation

　　Uplink QAM: Up to 64-QAM

　　LTE Speed

　　LTE Peak Download Speed: 300 Mbps

　　LTE Peak Upload Speed: 150 Mbps

　　Cellular Technology

　　LTE Technology: Qualcomm® Snapdragon™ All Mode, LTE FDD, LTE TDD, LTE Broadcast

　　Cellular Technology: WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

　　Wi-Fi

　　Wi-Fi Standards: 802.11ac Wave 2, 802.11a/b/g, 802.11n

　　Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz

　　Peak speed: 433 Mbps

　　Channel Utilization: 20/40/80 MHz

　　MIMO Configuration: 1x1 (1-stream)

　　Peak QAM: 256 QAM

　　Wi-Fi Features: MU-MIMO, Integrated baseband

　　Bluetooth

　　Bluetooth Version: Bluetooth 4.1

　　Bluetooth Technology: Bluetooth Low Energy

　　Location

　　Advanced Location Features: Low Power Geofencing and Tracking, Sensor-assisted Navigation, Pedestrian Navigation

　　Global Emergency Services Support: Assisted GPS, OTDOA (LTE-based positioning)

　　Location Support: Qualcomm® Location

　　Satellite Systems Support: GPS, GLONASS, Beidou, Galileo

　　NFC

　　Near Field Communications: Supported

　　RF

　　RFFE: Qualcomm® RF Front-End solution

　　USB

　　USB Version: USB 3.0

　　Camera

　　Megapixel Support: Up to 24 MP camera

　　Image Signal Processor: 2x Image Signal Processor (ISP)

　　Video

　　Video Capture: Up to 4K Ultra HD video capture @ 30FPS

　　Video Playback: Up to 4K Ultra HD video playback

　　Codec Support: H.265 (HEVC), H.264 (AVC)

　　Display

　　Maximum On-Device Display Support: FHD+, 1080p Full HD, 1900x1200, WUXGA

　　UI FPS: Up to 60 FPS

　　General Audio

　　Audio Technology: Qualcomm® Fluence™ HD noise cancellation technology

　　GPU

　　GPU Name: Qualcomm® Adreno™ 506 GPU

　　API Support: OpenGL ES 3.1+

　　Charging

　　Qualcomm® Quick Charge™ Support: Qualcomm® Quick Charge™ 3.0 technology

　　Security Support

　　Security Features: Qualcomm® Processor Security, Qualcomm® Content Protection, Qualcomm® Device Lock Authentication

　　Memory

　　Memory speed: 933MHz

　　Memory Type: LPDDR3

　　Storage

　　eMMC: eMMC 5.1

　　SD: SD 3.0 (SDCC)

　　Part

　　Part Numbers: 8953

　　msm8953 pro是什么处理器

　　高通msm8953 Pro也就是msm8953的升级版，msm8953命名为骁龙625，msm8953 pro是高通去年新发布的骁龙626处理器。作为升级版，骁龙626主要在性能方面有所提升，其余大部分规格与骁龙625基本相同。

　　骁龙626代号MSM8953Pro，也是625的升级版，主频从2GHz提升到2.2GHz，基带升级为LTEX9，支持蓝牙4.2，其他参数基本一致，采用14nm制程，支持QC3.0快充。

　　骁龙626是八核A53架构，由于A53是低性能低功耗的核心，加上14纳米工艺制造，可更好的降低发热量，节约手机电量。骁龙625目前在千元市场广受用户欢迎，也是得益于超长续航的特性，在性能已经足够的条件下，采用低功耗方案设计来延长手机续航时间，这才是打动用户选择的根本。

　　去年底高通发布的新款高端芯片骁龙820正是采用三星的14nmFinFET工艺生产。不过三星的产能显然不足够，导致骁龙820在广受市场欢迎的情况下面临缺货，中国手机企业转而纷纷采用高通的骁龙65X或联发科的芯片，在这样的情况下高通选择了同时在台积电和三星两家半导体工厂下单，确保产能。

　　这种平衡分配的方式显然不合理，上一款的芯片骁龙652/骁龙650采用台积电的28nm生产，而定位比它稍低的骁龙625却选择了三星的14nmFinFET工艺生产，最终中国手机企业考虑到功耗和成本等问题有相当多的手机企业反而选择了定位稍低的骁龙625而不是采用它的中高端芯片骁龙652/骁龙650。

　　msm8953 Pro 骁龙626很显然是今年的中端主打产品，目前已经有三星C7 Pro、三星C5 Pro采用了骁龙626，此外锤子坚果Pro、OPPO、Vivo等也对这款芯片很看好，估计今年的骁龙626又一次如骁龙625一样广受欢迎。