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AMD/XILINX

Xilinx:完全可编程、软件定义型和硬件优化型 Xilinx 是全球领先的完全可编程 FPGA、SoC、MPSoC 和 3D IC 领先供应商,能实现更智能的下一代互连而又各自不同的系统和网络。 在全行业都在转向云计算、SDN/NFV、视频无处不在 (Video Everywhere)、嵌入式视觉、工业物联网和 5G 无线的趋势推动下,Xilinx 推出的多种创新成果可实现这些既是软件定义型又是硬件优化型的应用。Xilinx 能够让应用同时实现软件定义和硬件优化—为云计算、5G 无线、嵌入式视觉和工业物联网行业发展提供了动力。2022年2月14日,AMD宣布完成了对赛灵思的收购,前赛灵思董事会成员 Jon Olson 和 Elizabeth Vanderslice 已加入 AMD 董事会。
为您找到相关结果 43529 2051 /2177
XA3S250E-4TQG144Q
型号:
XA3S250E-4TQG144Q
品牌:
AMD/赛灵思
产品分类:
现场可编程逻辑阵列
描述:
* Very low-cost, high-performance logic solution for high-volume automotive applications * Proven advanced 90-nanometer process technology * Multi-voltage, multi-standard SelectIO™ interface pins * Up to 376 I/O pins or 156 differential signal pairs * LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards * 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling * 622+ Mb/s data transfer rate per I/O * True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O * Enhanced Double Data Rate (DDR) support * DDR SDRAM support up to 266 Mb/s * Abundant, flexible logic resources * Densities up to 33,192 logic cells, including optional shift register or distributed RAM support * Efficient wide multiplexers, wide logic * Fast look-ahead carry logic * Enhanced 18 x 18 multipliers with optional pipeline * IEEE 1149.1/1532 JTAG programming/debug port * Hierarchical SelectRAM™ memory architecture * Up to 648 Kbits of fast block RAM * Up to 231 Kbits of efficient distributed RAM * Up to eight Digital Clock Managers (DCMs) * Clock skew elimination (delay locked loop) * Frequency synthesis, multiplication, division * High-resolution phase shifting * Wide frequency range (5 MHz to over 300 MHz) * Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing * Configuration interface to industry-standard PROMs * Low-cost, space-saving SPI serial Flash PROM * x8 or x8/x16 parallel NOR Flash PROM * Complete Xilinx ISE® and WebPACK™ software support * MicroBlaze™ and PicoBlaze™ embedded processor cores * Fully compliant 32-/64-bit 33 MHz PCI™ technology support * Low-cost QFP and BGA packaging options * Common footprints support easy density migration
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