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自1876年成立以来，汉高旗下众多品牌分别在个人消费及工业领域处于市场领先定位并享有美誉，比如宝莹(Persil)、施华蔻(Schwarzkopf)、乐泰(Loctite)等。汉高Loctite®产品用于多种市场，例如电子、汽车、航空航天、机器制造和医疗设备以及多个通用工业领域。乐泰化工产品系列包括各种用于工业生产、工业维护以及汽车保养和维护的解决方案。汉高Loctite®生产线包括用于粘接接合处的润滑剂、脱模剂、清洁剂和其他专用产品。

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热润滑脂,环氧树脂

LOCTITE ABLESTIK 285 BK

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Thrml Mgmt Access Thermal Insulator

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SP2000-0.020-AC-00

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Thrml Mgmt Access Thermal Insulator White 2.02°C/W 3.5W/m.K 10Xe13Ohm.cm

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SP2000-0.010-AC-1212

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Thrml Mgmt Access Thermal Insulator White 2.02°C/W 3.5W/m.K 10Xe13Ohm.cm

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3D打印机,树脂,DLP系列,0.1mm,110V,200W,192mmx108mmx250mm建造体积

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The D4014 500G REEL is a 2.03mm 40/60 (Tin/Lead) grade Solder Wire, made of Sn and Pb alloy. It features 234°C meting temperature. . Insoluble in water

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The LOCTITE 4062 series Ethyl Cyanoacrylate Adhesive designed for bonding of plastics and elastomeric materials where very fast fixturing is required. The low viscosity is particularly suitable for bonding applications where controlled penetration of adhesive is required. Under normal conditions, the atmospheric moisture initiates the curing process. Although full functional strength is developed in a relatively short time, curing continues for at least 24-hour before full chemical/solvent resistance is developed. The rate of cure will depend on the bondline gap. Thin bond lines result in high cure speeds, increasing the bond gap will decrease the rate of cure. Where cure speed is unacceptably long due to large gaps, applying activator to the surface will improve cure speed. However, this can reduce ultimate strength of the bond and therefore testing is recommended to confirm effect. . Very low viscosity . Humidity cure Not recommended for use in pure oxygen or oxygen rich system and should not be selected as a sealant for chlorine or other strong oxidizing materials.

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The 609973 is a no clean, clear residue cored Solder Wire designed to give fast and sustained wetting on both copper and brass. Multicore Crystal solid fluxes for cored solder wires have been specially formulated to complement No Clean wave and reflow soldering processes. It is also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. Multicore Crystal 400 is designed for users who require a halide-free formulation while Crystal 500 contains a low level of halide. The remaining products in the range contain higher halide levels to maximise soldering power. . Halide free version, Crystal 400 . Fast soldering, range of activities to suit all applications . Good spread on copper, brass and nickel . Clear residues . Heat stable, low spitting . Mild odour

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The 904569 is a no clean cored Solder Wire contains a careful balance of resins and activators to provide minimal residues, high activity and good reliability without cleaning. Multicore X52 low residue solid flux has been specially formulated to complement no clean wave and reflow soldering processes where extra activity is required. It is also applicable to repair operations following a cleaning process to eliminate the need for further cleaning. Multicore X52 cored wire is manufactured as standard with a nominal flux content of 1% and are available in alloys Sn60 and Sn62 conforming to J-STD-006 and EN 29453 or alloys conforming to similar national and international standards and 99C lead-free alloy. The optimum tip temperature and heat capacity required for a hand soldering process is a function of the design of the iron and the task. . Eliminates cost of cleaning . Fast and sustained soldering on copper and brass . Non-corrosive formulation . Negligible residues

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