基于STM32主控芯片的智能锁电子硬件方案
应用领域:智能家居
方案类型:软件
主控芯片:STM;
方案概述
智能锁方案说明(V1.2版)
一、方案介绍
V1.2版智能锁方案是新一代集“指纹/密码/刷卡/遥控/手机动态密钥”五大控制单元集一体的智能电路系统。
目前我们的方案主要应用于智能指纹锁、指纹控制门禁系统、指纹智能管险柜等领域. V1.2版系统配备OLED显示屏、时尚触摸键盘、真人语音提示操作信息指引,使用户的操作更智能更简单、更人性化,无需操作说明书既可根据语音+显示指引进行操作设置。
V1.2版系统主要如有如下特性:
1) 智能---真人中英文语音+显示引导操作,管理员与普通用户的权限管理区分。
2) 安全---防偷窥输入设计虚位密码功能,让整个系统与用户交互很简易和安全。
3) 精准---与国内外多家顶级主自研发生产的指纹采集器公司对接,使指纹识别的安全,速率,纠错特性发挥到更加安全及高效率。
4) 高速---从唤醒到比对成功1比N只需要320毫秒.待机感应上电,智能唤醒系统及无操作自动休眠。
5) 耐用---采用多级ESD放电防护处理,器件设计选型上都采用工业级应用,防水、防尘工艺处理,高低温寿命老化测试-40---+75度,>10万次开锁次数
6) 省电---功能功率小于150毫安,静态功率小于60~100微安,普通咸性电池使用续航8—12个月。
7) 灵活---方案已经与多家主流外设厂商对接,如:指纹读头、OLED等,让使用方案厂商更灵活选择合适供应商同时也降低缺货风险。
二、主要性能参数
l 指纹容量:1-500枚(可扩展)
l 密码容量:1-20枚 (可扩展)
l IC卡容量:1-100张(可扩展)
l 遥 控: 2只(选配)
l 动态密码:安装APP软件既可实现(目前只有安卓版)
l 工作电流:平均150Ma
l 待机电流:80UA(平均待机功耗)
l 操作记录:16000条
l 验证方式:可设置单验证及组合验证方式
l 虚位密码:为防止被偷窥真是密码,输入密码前后随便加入数字,只要输入字符串有连续6位正确密码就可以通过验证开门
三、操作说明
V1.2版系统采用4键制管理操作“2号键上 ,8号键下,#键确认,*键返回
1. 恢复出厂设置
系统默认为出厂状态(系统清空状态)出厂状态下为演示模式任意指纹都能开门。
方式1:长按实体按键SET(设置键)键5秒以上,听到“叮”提示音后松开。
方式2:管理员身份进入管理菜单->系统设置->恢复出厂->请确认“#”->恢复出厂。
2. 进入设置功能菜单
要进入系统菜单,必需通过设置操作,出厂状态下设置操作会直接录入超级管理员指纹,超级管理员只有系统清空(恢复出厂设置)操作下才被清空。
方式1: 待机->按键唤醒->按“#”键。
方式2:短按SET(设置键)。
3. 指纹增加
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->指纹设置->添加指纹->选择ID号(1-5为管理员) ->录入指纹(3次对比录入)。
4.指纹删除
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->指纹设置->删除指纹->选择ID号(1-5为管理员)->确认删除->删除成功。
5.密码增加
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->密码设置->添加密码->选择ID号(1-2为管理员)->输入密码6-12位->确认输入->增加成功。
6.密码删除
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->密码设置->删除密码->选择ID号(1-2为管理员)->确认删除->删除成功。
7.添加IC卡
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->IC卡设置—增加IC卡->选择ID号->请刷IC卡---增加成功。
8.删除IC卡
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->IC卡设置->删除IC卡->选择ID号->确认删除->删除成功 。
9.遥控设置
遥控单元默认为选配项目,不配接收模块及遥控器,需要另特别说明才能正常使用,而且必需要使用我司配套的遥控器才能使用。
9.1.增加遥控器
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->遥控设置->添加遥控->进入学习状态->按我司配套的遥控器任意键->听到添加成功后->学习成功->可继续添加。
9.2.删除遥控器
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->遥控设置—删除遥控—确认删除—删除成功。
10.系统设置
10.1时间设置
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->系统设置->时间设置->输入需求设置的时间(年,月,日,时,分,)->确认->设置成功。
10.2验证方式
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->系统设置->验证方式->按2与8号键上下翻选择开门验证方式->确认->设置成功。(默认为单验证方式开门,可选择双验证(任意两种组合都可以验证通过))。
10.3语言设置
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->系统设置->语言设置->按2与8号键上下翻可以选择一种语言(目前支持中简体,中繁体,英文三种选择)。
10.4出厂设置
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->系统设置->出厂设置->选择恢复出厂->是否确认->确认->出厂设置成功(删除所有已存信息所有设置恢复到出厂状态)。
10.5动态密钥
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->系统设置->动态密匙->显示动态密匙解密序号(此序号只能用于我司开发的远程动态密码开门的APP,具体操作方法参数APP应用设置指南,此功能费物联网功能)。
11.记录查询
11.1系统容量查询
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->系统设置->记录查询->查询系统容量已使用/未使用容量->按2与8分别上翻与下翻,#键确认*键返回。
11.2开门记录查询
待机->按键唤醒->按“#”键(按菜单键)->验证管理员指纹或密码->系统设置->记录查询->按2与8分别上翻与下翻,#键确认*键返回-总记录为16000条。
STM主控芯片:
STM32F429VE
STM32F071VB
STM32F423ZH
STM32F103C6
STM32F071V8
STM32F427AI
STM32F103C8
STM32F427AG
STM32F078CB
STM32F103C4
STM32F070CB
STM32F446ZC
STM32F439BG
STM32F469ZE
STM32F446ZE
STM32F439BI
STM32F102R6
STM32F070C6
STM32F469ZG
STM32F103T8
STM32F413MH
STM32F102R8
STM32F469ZI
STM32F413MG
STM32F103CB
STM32F429VI
STM32F103T4
STM32F102R4
STM32F429VG
STM32F103T6
STM32F417VE
STM32F105VB
STM32F103RE
STM32F103RF
STM32F103RG
STM32F105VC
STM32F103RB
STM32F103RC
STM32F103RD
STM32F407IG
STM32F407IE
STM32F205ZE
STM32F205ZC
STM32F205ZF
STM32F205ZG
STM32F415RG
STM32F417VG
STM32F405VG
STM32F407ZG
STM32F072VB
STM32F407ZE
STM32F070RB
STM32F479IG
STM32F479II
STM32F072V8
STM32F071CB
STM32F217ZG
STM32F215VE
STM32F105V8
STM32F103R6
STM32F217ZE
STM32F103R8
STM32F071C8
STM32F215VG
STM32F103R4
STM32F439VG
STM32F446MC
STM32F051K4
STM32F439VI
STM32F446ME
STM32F100ZD
STM32F051K6
STM32F100ZE
STM32F051K8
STM32F217IG
STM32F217IE
STM32F429IG
STM32F429IE
STM32F437AI
STM32F479ZG
STM32F423MH
STM32F479ZI
STM32F078RB
STM32F427VG
STM32F429ZI
STM32F469NE
STM32F429ZG
STM32F469NG
STM32F429ZE
STM32F071RB
STM32F469NI
STM32F429II
STM32F038K6
STM32F417IG
STM32F417IE
STM32F072CB
STM32F100ZC
STM32F072C8
STM32F427VI
STM32F101ZG
STM32F415VG
STM32F417ZG
STM32F101ZC
STM32F105R8
STM32F101ZD
STM32F417ZE
STM32F101ZE
STM32F101ZF
STM32F105RC
STM32F107VB
STM32F107VC
STM32F105RB
STM32F207ZC
STM32F207ZF
STM32F207ZG
STM32F205VE
STM32F205VB
STM32F207ZE
STM32F205VC
STM32F205VF
STM32F413RH
STM32F205VG
STM32F413RG
STM32F215RG
STM32F401RD
STM32F401RE
STM32F058T8
STM32F042K4
STM32F401RB
STM32F405ZG
STM32F401RC
STM32F042K6
STM32F207IE
STM32F207IF
STM32F207IC
STM32F303RC
STM32F439IG
STM32F207IG
STM32F072R8
STM32F439II
STM32F413CG
STM32F058C8
STM32F217VG
STM32F215RE
STM32F217VE
STM32F100VD
STM32F437VI
STM32F412RG
STM32F100VE
STM32F412RE
STM32F479NG
STM32F100VB
STM32F100VC
STM32F479NI
STM32F030K6
STM32F413CH
STM32F048G6
STM32F427II
STM32F401CE
STM32F427IG
STM32F401CC
STM32F401CD
STM32F401CB
STM32F072RB
STM32F439ZG
STM32F437VG
STM32F439ZI
STM32F427ZI
STM32F427ZG
STM32F058R8
STM32F051T8
STM32F469BE
STM32F469AE
STM32F412CG
STM32F469AG
STM32F412CE
STM32F429NI
STM32F469AI
STM32F429NG
STM32F429NE
STM32F051C4
STM32F100V8
STM32F051C6
STM32F446RC
STM32F038G6
STM32F051C8
STM32F446RE
STM32F423RH
STM32F103ZE
STM32F101VC
STM32F103ZF
STM32F101VD
STM32F103ZG
STM32F101VE
STM32F205RF
STM32F413VH
STM32F101VF
STM32F205RG
STM32F411RE
STM32F413VG
【STM32F413VG】
High-performance access line, ARM Cortex-M4 core with DSP and FPU, 1 MByte Flash, 100 MHz CPU, ART Accelerator, DFSDM
The STM32F413xG/H devices are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32F413xG/H devices belong to the STM32F4 access product lines (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.
The STM32F413xG/H devices incorporate high-speed embedded memories (up to 1.5 Mbytes of Flash memory, 320 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.
All devices offer a 12-bit ADC, two 12-bit DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timer for motor control, two general-purpose 32-bit timers and a low power timer.
They also feature standard and advanced communication interfaces.
Key Features
Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode)
1.7 V to 3.6 V power supply
-40 °C to 85/105/125 °C temperature range
Core: Arm® 32-bit Cortex® -M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
Memories
Up to 1.5 Mbytes of Flash memory
320 Kbytes of SRAM
Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
Dual mode Quad-SPI interface
LCD parallel interface, 8080/6800 modes
Clock, reset and supply management
1.7 to 3.6 V application supply and I/Os
POR, PDR, PVD and BOR
4-to-26 MHz crystal oscillator
Internal 16 MHz factory-trimmed RC
32 kHz oscillator for RTC with calibration
Internal 32 kHz RC with calibration
Power consumption
Run: 112 μA/MHz (peripheral off)
Stop (Flash in Stop mode, fast wakeup time): 42 μA Typ.; 80 μA max @25 °C
Stop (Flash in Deep power down mode, slow wakeup time): 15 μA Typ.; 46 μA max @25 °C
Standby without RTC: 1.1 μA Typ.; 14.7 μA max at @85 °C
VBAT supply for RTC: 1 μA @25 °C
2x12-bit D/A converters
1×12-bit, 2.4 MSPS ADC: up to 16 channels
6x digital filters for sigma delta modulator, 12x PDM interfaces, with stereo microphone and sound source localization support
General-purpose DMA: 16-stream DMA
Up to 18 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer, and a low-power timer
Debug mode
Serial wire debug (SWD) & JTAG
Cortex® -M4 Embedded Trace Macrocell™
Up to 114 I/O ports with interrupt capability
Up to 109 fast I/Os up to 100 MHz
Up to 114 five V-tolerant I/Os
Up to 24 communication interfaces
Up to 4x I2 C interfaces (SMBus/PMBus)
Up to 10 UARTS: 4 USARTs / 6 UARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces
SDIO interface (SD/MMC/eMMC)
Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY
3x CAN (2.0B Active)
1xSAI
True random number generator
CRC calculation unit
96-bit unique ID
RTC: subsecond accuracy, hardware calendar
All packages are ECOPACK® 2
电路原理图
责任编辑:Davia
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