大联大控股宣布，其旗下友尚推出基于意法半导体(ST)STM32F103与德州仪器(TI)CC2564的智能车载双模蓝牙方案WLT2564S。该车载双模蓝牙方案可以服务于逆变器为12v转220v 1500w的电源转换器，用户通过蓝牙无线连接到手机或平板计算机，可以通过APP来监控智能电源转换器工作时的各种状况，如超载保护、短路保护、过压保护、欠压保护、欠压报警、过温保护、电瓶电源使用到转换器警报提示等相关使用安全控制和提示功能。

随着车载电源逆变器的普及率增高，人们出行时越来越习惯于使用逆变器连接蓄电池带动电器及各种工具工作，把家用电器连接到电源转换器的输出端，人们就能在汽车内使用各种电器。手机、笔记本电脑、数码摄像机、照相机、照明灯、电动剃须刀、游戏机、笔记本电脑、电动工具、车载冰箱及各种旅游、野营、医疗急救电器等都可以使用车载逆变器连接充电并使用。

大联大友尚推出的智能车载双模蓝牙方案WLT2564S可以帮助用户进一步实现经由移动装置，实现监控、观察电源转换器的重要信息的需求或者实时接收重要的警报提示的需求。方案采用TI CC2564 Supports Bluetooth 4.0 and Dual-Mode(BR/EDR/LE)Controller，WLT2564S双模蓝牙透传模块，同时集成了STM32F103系列MCU、Flash(128KB-1M)、RAM(20KB-96KB)。方案中板载采用高性能陶瓷2.4GHz天线，可以外接;尺寸为19*30mm，为邮票孔管脚;系统支持UART/SPI，UART接口最高可达4Mbps;支持I2C接口，可用于外接加密，支持PCM接口、支持I2S接口;支持透明协议数据传输模式，可提供AT+指令集配置;支持蓝牙SPP/SPPLE/HFP/MAP/PXP/A2DP/AVRCP/ANP/HID等。

大联大友尚同时针对该智能车载双模蓝牙方案提供软件平台，平台可以灵活地帮助工程师完成方案开发，同时可以提供定制化服务。

图示1-WLT2564S模块线路图

图示2-WLT2564S方案方框图

STM32F103

STM32F系列属于中低端的32位ARM微控制器，该系列芯片是意法半导体(ST)公司出品，其内核是Cortex-M3。

该系列芯片按片内Flash的大小可分为三大类：小容量(16K和32K)、中容量(64K和128K)、大容量(256K、384K和512K)。

芯片集成定时器，CAN，ADC，SPI，I2C，USB，UART，等多种功能。

MCU简介

内核

--ARM 32位的Cortex-M3

--最高72MHz工作频率，在存储器的0等待周期访问时可达1.25DMips/MHZ(DhrystONe2.1)

--单周期乘法和硬件除法

存储器

--从16K到512K字节的闪存程序存储器(STM32F103XXXX中的第二个X表示FLASH容量，其中：“4”=16K，“6”=32K，“8”=64K，B=128K，C=256K，D=384K，E=512K)

--最大64K字节的SRAM

电源管理

--2.0-3.6V供电和I/O引脚

--上电/断电复位(POR/PDR)、可编程电压监测器(PVD)

--4-16MHZ晶振振荡器

--内嵌经出厂调教的8MHz的RC振荡器

--内嵌带校准的40KHz的RC振荡器

--产生CPU时钟的PLL

--带校准的32KHz的RC振荡器

低功耗

--睡眠、停机和待机模式

--Vbat为RTC和后备寄存器供电

模数转换器

--2个12位模数转换器，1us转换时间(多达16个输入通道)

--转换范围：0至3.6V

--双采样和保持功能

--温度传感器

DMA

--2个DMA控制器，共12个DMA通道：DMA1有7个通道，DMA2有5个通道

--支持的外设：定时器、ADC、SPI、USB、IIC和UART

--多达112个快速I/O端口(仅Z系列有超过100个引脚)

--26/37/51/80/112个I/O口，所有I/O口一块映像到16个外部中断;几乎所有的端口均可容忍5V信号

调试模式

--串行单线调试(SWD)和JTAG接口

--多达8个定时器

--3个16位定时器，每个定时器有多达4个用于输入捕获/输出比较/PWM或脉冲计数的通道和增量编码器输入

--1个16位带死区控制和紧急刹车，用于电机控制的PWM高级控制定时器

--2个看门狗定时器(独立的和窗口型的)

--系统时间定时器：24位自减型计数器

--多达9个通信接口：

2个I2C接口(支持SMBus/PMBus)

3个USART接口(支持ISO7816接口，LIN，IrDA接口和调制解调控制)

2个SPI接口(18M位/秒)

CAN接口(2.0B主动)

USB 2.0全速接口

计算单元

CRC计算单元，96位的新批唯一代码

封装

ECOPACK封装

应用

STM32F103R8T6是ST旗下的一款常用的增强型系列微控制器，适用于：

电力电子系统方面的应用

电机驱动

应用控制

医疗

手持设备

PC游戏外设

GPS平台

编程控制器(PLC)

变频器

扫描仪

打印机

警报系统

视频对讲

暖气通风

空调系统

LED 条屏控制

CC2564

蓝牙 Smart Ready 控制器

描述

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Handsfree profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

特性

TI’s Single-Chip Bluetooth Solution With Bluetooth

Basic Rate (BR), Enhanced Data Rate (EDR), and

Low Energy (LE) Support; Available in Two

Variants:

Dual-Mode Bluetooth CC2564 Controller

Bluetooth CC2560 Controller

CC2564 Bluetooth 4.1 Controller Subsystem

Qualified (QDID 58852); Compliant up to the HCI

Layer

Highly Optimized for Low-Cost Designs:

Single-Ended 50-Ω RF Interface

Package Footprint: 76 Terminals, 0.6-mm Pitch,

8-mm x 8-mm mrQFN

BR/EDR Features Include:

Up to 7 Active Devices

Scatternet: Up to 3 Piconets Simultaneously, 1

as Master and 2 as Slaves

Up to 2 SCO Links on the Same Piconet

Support for All Voice Air-Coding – Continuously

Variable Slope Delta (CVSD), A-Law, µ-Law,

and Transparent (Uncoded)

CC2560B/CC2564B Devices Provide an

Assisted Mode for HFP 1.6 Wideband Speech

(WBS) Profile or A2DP Profile to Reduce Host

Processing and Power

Support of Multiple Bluetooth Profiles With

Enhanced QoS

LE Features Include:

Support of Up to 10 (CC2564B) Connections

Multiple Sniff Instances Tightly Coupled to

Achieve Minimum Power Consumption

Independent Buffering for LE Allows Large

Numbers of Multiple Connections Without

Affecting BR/EDR Performance.

Built-In Coexistence and Prioritization Handling

for BR/EDR and LE

Best-in-Class Bluetooth (RF) Performance

(TX Power, RX Sensitivity, Blocking)

Class 1 TX Power Up to +10 dBm

–95 dbm Typical RX Sensitivity

Internal Temperature Detection and

Compensation to Ensure Minimal Variation in

RF Performance Over Temperature, No

External Calibration Required

Improved Adaptive Frequency Hopping (AFH)

Algorithm With Minimum Adaptation Time

Provides Longer Range, Including 2x Range

Over Other LE-Only Solutions

Advanced Power Management for Extended

Battery Life and Ease of Design

On-Chip Power Management, Including Direct

Connection to Battery

Low Power Consumption for Active, Standby,

and Scan Bluetooth Modes

Shutdown and Sleep Modes to Minimize Power

Consumption

Physical Interfaces:

UART Interface With Support for Maximum

Bluetooth Data Rates

UART Transport Layer (H4) With Maximum

Rate of 4 Mbps

Three-Wire UART Transport Layer (H5) With

Maximum Rate of 4 Mbps (CC2560B and CC2564B Only) Fully Programmable Digital PCM-I2S Codec

Interface

Flexibility for Easy Stack Integration and Validation

Into Various Microcontrollers, Such as MSP430™

and ARM® Cortex®-M3 and Cortex®-M4 MCUs

CC256x Bluetooth Hardware Evaluation Tool: PC- Based Application to Evaluate RF Performance of the Device and Configure Service Pack

Device Pin-to-Pin Compatible With Previous Devices or Modules