原标题：Renesas RX23W32位RX MCU应用方案

　　Renesas公司的RX23W是54MHz 32位RX mcu,内置了FPU(和IEEE75兼容),54 MHz时的性能为88.56 DMIPS;集成了高达512KB闪存,Bluetooth 5.0以及多种通信功能如USB 2.0全速主/功能/OTG,CAN,SD主接口,串行声接口,容性触摸检测单元,12位ADC,12位DAC以及RTC和加密功能.RX23W的CISC哈佛架构具有5级流水线,可变长度指令和超紧凑代码,片上集成了调试电路,支持存储器保护单元(MPU)和温度传感器.单电源1.8-V-3.6-V工作,工作温度-40到+85度C.有三种降功耗模式.主要用在通用工业和消费类电子设备.本文介绍了RX23W主要特性和特性指标表,框图以及RX23W目标板RTK5RX23W0C00000BJ主要特性和指标,框图与运行环境图,电路图和材料清单与元件布局图.

　　RX23W microcontrollers incorporate security functions that are vital for Bluetooth® 5.0 Low Energy (BLE) and IoT devices, as well as a wealth of peripheral functions such as touch keys, USB and CAN, enabling system control and wireless communication with devices using a single chip. RX23W MCUs have full function support for Bluetooth 5.0 Low Energy long range and mesh networking, and provide excellent reception performance.

　　RX23W主要特性:

　　■ 32-bit RXv2 CPU core

　　 Max.operating frequency: 54 MHz

　　Capable of 88.56 DMIPS in operation at 54 MHz

　　 Enhanced DSP: 32-bit multiply-accumulate and 16-bitmultiply-subtract instructions supported

　　 Built-in FPU: 32-bit single-precision floating point (compliant toIEEE754)

　　 Divider (fastest instruction execution takes two CPU clock cycles)

　　 Fast interrupt

　　 CISC Harvard architecture with 5-stage pipeline

　　 Variable-length instructions, ultra-compact code

　　 On-chip debugging circuit

　　 Memory protection unit (MPU) supported

　　■ Low power design and architecture

　　 Operation from a single 1.8-V to 3.6-V supply

　　 RTC capable of operating on the battery backup power supply

　　 Three low power consumption modes

　　 Low power timer (LPT) that operates during the software standby state

　　■ On-chip flash memory for code

　　 384- to 512-Kbyte capacities

　　 On-board or off-board user programming

　　 Programmable at 1.8 V

　　 For instructions and operands

　　■ On-chip data flash memory

　　 8 Kbytes (1,000,000 program/erase cycles (typ.))

　　 BGO (Background Operation)

　　■ On-chip SRAM, no wait states

　　 64-Kbyte size capacities

　　■ Data transfer functions

　　 DMAC: Incorporates four channels

　　 DTC: Four transfer modes

　　■ ELC

　　 Module operation can be initiated by event signals without usinginterrupts.

　　 Linked operation between modules is possible while the CPU is sleeping.

　　■ Reset and supply management

　　 Eight types of reset, including the power-on reset (POR)

　　 Low voltage detection (LVD) with voltage settings

　　■ Clock functions

　　 Main clock oscillator frequency: 1 to 20 MHz

　　 External clock input frequency: Up to 20 MHz

　　 Sub-clock oscillator frequency: 32.768 kHz

　　 Frequency of Bluetooth-dedicated clock oscillator: 32 MHz

　　 PLL circuit input: 4 MHz to 12.5 MHz

　　 On-chip low- and high-speed oscillators, dedicated on-chip low-speedoscillator for the IWDT

　　 USB-dedicated PLL circuit: 4, 6, 8, or 12 MHz

　　54 MHz can be set for the system clock and 48 MHz for the USB clock

　　 Generation of a dedicated 32.768-kHz clock for the RTC

　　 Clock frequency accuracy measurement circuit (CAC)

　　■ Realtime clock

　　 Adjustment functions (30 seconds, leap year, and error)

　　 Calendar count mode or binary count mode selectable

　　 Time capture function

　　 Time capture on event-signal input through external pins

　　■ Independent watchdog timer

　　 15-kHz on-chip oscillator produces a dedicated clock signal to driveIWDT operation.

　　■ Useful functions for IEC60730 compliance

　　 Self-diagnostic and disconnection-detection assistance functions forthe A/D converter, clock frequency accuracy measurement circuit,independent watchdog timer, RAM test assistance functions using theDOC, etc.

　　■ MPC

　　 Input/output functions selectable from multiple pins

　　■ Up to 12 communication functions

　　 Bluetooth Low Energy (1 channel)

　　An RF transceiver and link layer compliant with the Bluetooth 5.0 LowEnergy specification

　　LE 1M PHY, LE 2M PHY, LE Coded PHY (125 kbps and 500 kbps),and LE Advertising extension support

　　On-chip Bluetooth-dedicated AES-CCM (128-bit blocks) encryptioncircuit

　　 USB 2.0 host/function/On-The-Go (OTG) (one channel),full-speed = 12 Mbps, low-speed = 1.5 Mbps, isochronous transfer, andBC (Battery Charger) supported

　　 CAN (one channel) compliant to ISO11898-1:Transfer at up to 1 Mbps

　　 SCI with many useful functions (up to 4 channels)

　　Asynchronous mode, clock synchronous mode, smart card interface

　　Reduction of errors in communications using the bit modulationfunction

　　 IrDA interface (one channel, in cooperation with the SCI5)

　　 I2C bus interface: Transfer at up to 400 kbps, capable of SMBusoperation (one channel)

　　 RSPI (one channel): Transfer at up to 16 Mbps

　　 Serial sound interface (one channel)

　　 SD host interface (optional: one channel) SD memory/ SDIO 1-bit or4-bit SD bus supported

　　■ Up to 19 extended-function timers

　　 16-bit MTU: input capture, output compare, complementary PWMoutput, phase counting mode (five channels)

　　 16-bit TPU: input capture, output compare, phase counting mode (sixchannels)

　　 8-bit TMR (four channels)

　　 16-bit compare-match timers (four channels)

　　■ 12-bit A/D converter

　　 Capable of conversion within 0.83 μs

　　 14 channels

　　 Sampling time can be set for each channel

　　 Self-diagnostic function and analog input disconnection detectionassistance function

　　■ 12-bit D/A converter

　　 Two channels

　　■ Capacitive touch sensing unit

　　 Self-capacitance method: A single pin configures a single key,supporting up to 12 keys

　　 Mutual capacitance method: Matrix configuration with 12 pins, supportingup to 36 keys

　　■ Analog comparator

　　 Two channels × one unit

　　■ General I/O ports

　　 5-V tolerant, open drain, input pull-up, switching of driving capacity

　　■ Encryption functions (TSIP-Lite)

　　 Unauthorized access to the encryption engine is disabled andimposture and falsification of information are prevented

　　 Safe management of keys

　　 128- or 256-bit key length of AES for ECB, CBC, GCM, others

　　 True random number generator

　　■ Temperature sensor

　　■ Operating temperature range

　　 40 to +85C

　　RX23W应用:

　　 General industrial and consumer equipment

　　RX23W主要指标特性表:

　　图1.RX23W框图

　　RX23W目标板RTK5RX23W0C00000BJ

　　Thank you for purchasing the Target Board for RX23W evaluation tool from Renesas (hereinafter referred to as “this product”). This product consists of the Target Board for RX23W (RTK5RX23W0C00000BJ).

　　This product is an evaluation tool for a Renesas MCU. This manual descries hardware specifications, how to set switches, and basic setup procedures.

　　RX23W目标板主要特性:

　　• Programming of the Renesas MCU

　　• Debugging of user code

　　• Evaluation of Bluetooth Low Energy (BLE) communications

　　• User circuits for switches and LEDs

　　• Sample applications*1

　　• Samples of peripheral-function initialization code*

　　RX23W目标板主要指标:

　　图2. RX23W目标板框图

　　图3.RX23W目标板顶层布局图

　　图4.RX23W目标板运行环境图

　　RX23W目标板材料清单: