原标题：大联大诠鼎集团推出基于Qualcomm产品，且支持Always On voice的蓝牙耳机解决方案

　　致力于亚太地区市场的领先半导体元器件分销商---大联大控股宣布，其旗下诠鼎推出基于高通(Qualcomm)QCC5126的，且支持Always On voice的TWS plus蓝牙耳机解决方案。

　　QCC512x系列芯片是Qualcomm最新一代立体声TWS plus技术的蓝牙5.0芯片。该系列芯片的主要功能包括：A2DP、AVRCP、HFP、HSP、SPP等基本功能和aptX Audio、Broadcast Audio、Always On voice、ANC、TWS plus等特色功能。根据封装体积大小、可用pin脚数量、ANC方式、工作电流差异、interface类型及生产制造成本的不同可分为以下五种芯片：

　　1. QCC5120：WLCSP_81，3.98*4.02*0.5 mm3，Stereo，two DSP

　　2. QCC5121：VFBGA_124，6.5*6.5*1.0 mm3，Stereo，two DSP

　　3. QCC5124：VFBGA_90，5.5*5.5*1.0 mm3，Stereo，two DSP

　　4. QCC5125：VFBGA_90，5.5*5.5*1.0 mm3，Stereo，one DSP

　　5. QCC5126：VFBGA_90，5.5*5.5*1.0 mm3，Stereo，two DSP

　　图示1-大联大诠鼎推出基于Qualcomm产品，且支持Always On voice的蓝牙耳机解决方案的展示板图

　　由大联大诠鼎推出的基于Qualcomm QCC5126的蓝牙耳机解决方案除了基本功能之外的最大特色就是Always On voice功能。

　　Always On voice的工作原理：当QCC5126处于待机状态时，蓝牙芯片内部有一个0.85V的LDO持续为DSP供电，DSP通过连接的MIC持续监听外部的声音，当监听到事先设置的关键词时，DSP会输出信号给MCU内核，QCC5126就会执行相应操作。

　　Always On voice持续不断的监听：当蓝牙耳机处于待机状态时，仍然可以使用语音唤醒耳机，控制耳机执行上一首/下一首歌曲，音量加/减等操作功能，无需用户亲自动手就可以完成这些功能操作，极大地提高了耳机使用的便捷性和智能性。

　　Always On voice的先进性：目前市场上很多具有语音功能的蓝牙耳机需要使用带有MCU算法的MIC去监听关键词，再把MCU的处理信号传递给蓝牙芯片。这样不仅成本较高(要使用专门的MIC)并且待机功耗较大(MIC内部的MCU和蓝牙芯片均耗电)。Qualcomm的QCC5126将MIC算法集成到芯片内部的DSP，只需使用普通的MIC，并且待机时保持低至uA级的关机电流，比市场上的其它同类产品更具竞争优势。

　　图示2-大联大诠鼎推出基于Qualcomm产品，且支持Always On voice的蓝牙耳机解决方案的方案块图

　　核心技术优势

　　蓝牙5.0版本，更低的功耗，更远的连接距离，更大的数据吞吐率;

　　低功耗：听歌电流6mA，通话电流7mA，待机45uA，关机<1uA;

　　双耳通话，打电话时，两只耳机都有声音，都可以通话;

　　Always On voice待机状态下，可以语音唤醒耳机，可以语音控制耳机执行上/下一首等操作;

　　ANC主动降噪功能，可有效降低周围的环境噪声，给用户更纯净的聆听音乐环境;

　　支持Qualcomm Broadcast Audio，“一对多”广播传输。

　　方案规格

　　Bluetooth v5.0 specification support

　　Qualcomm? Bluetooth? Low Energy secure connection

　　A2DP v1.3.1

　　AVRCP v1.6

　　HFP v1.7

　　HSP v1.2

　　SPP v1.2

　　DID v1.3

　　HID v1.1

　　PXP v1.0.1

　　FMP v1.0

　　BAS v1.0

　　QCC5126

　　Extremely low power premium tier Bluetooth Audio SoC in a BGA package, designed for use in compact, voice enabled, feature rich wire-free earbuds, hearables and headsets.

　　The Qualcomm® QCC5126 System-on-Chip (SoC) is designed to meet consumer demand for robust, high quality, wireless Bluetooth listening experiences with support for voice assistants. The SoC is optimized for small form-factor devices to support extremely low power consumption for longer audio playback.

　　QC5126 is a part of the Qualcomm® QCC5100 Low Power Bluetooth Audio SoC Series.

　　QCC5126 and Qualcomm QCC5100 are products of Qualcomm Technologies, Inc., and/or its subsidiaries.

　　Featured Documents

　　Product Brief

　　Voice assistant support

　　Support for voice services including Amazon Voice Services and the Google Assistant.

　　Extremely low power

　　SoC designed to support development of small form factor, richly-featured earbuds that can be used all day, with up to 10 hours of play from a 65mHA battery.

　　High quality wireless audio

　　Qualcomm® aptX™ Audio, aptX HD, and aptX Adaptive technologies are designed to deliver consistent, high quality audio streaming over Bluetooth.

　　Features

　　Extremely low power design

　　Bluetooth 5 radio

　　2Mbps Bluetooth low energy (LE) support

　　Ultra-small form factor

　　Powerful quad-core processor architecture

　　Dual core 32-bit processor application subsystem

　　Dual core Qualcomm® Kalimba™ DSP Audio subsystem

　　Embedded ROM + RAM and external Q-SPI Flash

　　Integrated PSRAM for audio buffering

　　2-ch 98dBA headset class D

　　High performance low power audio

　　2-ch 99dBA line inputs (single ended)

　　192kHz 24-bit I2S & SPDIF interfaces

　　Fully programmable digital ANC

　　Designed to support digital assistants, Push to Talk/Voice Activated

　　Flexible software platform with powerful new IDE support

　　Designed to support aptX, aptX HD and aptX Adaptive

　　Designed to support Qualcomm TrueWireless™ Stereo and Qualcomm TrueWireless Stereo Plus

　　Integrated battery charger supporting internal mode (up to 200 mA) and external mode (up to 1.8 A)

　　Designed for reduced eBoM through highly integrated SoC design

　　SpecificationsCPUCPU Clock Speed: Up to 80 MHz

　　CPU Features: Programmable Apps CPU

　　CPU Architecture: 32-bit

　　DSPDSP RAM: 80kB (P) + 256kB (D)

　　DSP Technology: 1x Qualcomm® Kalimba™ DSP, Configurable DSP

　　DSP Clock Speed: 1x 120 MHz DSP

　　BluetoothBluetooth Version: Bluetooth 5.0

　　Bluetooth Technology: Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

　　Bluetooth Speed: 2 Mbps

　　Voice ServicesDigital Assistant Activation: Button press, Qualcomm® Voice Activation

　　General AudioAudio Technology: Qualcomm TrueWireless™ Stereo technology, Qualcomm TrueWireless™ Stereo Plus technology, Qualcomm® Active Noise Cancellation (ANC) technology, Qualcomm® Broadcast Audio technology, Qualcomm® aptX™ audio technology, Qualcomm® cVc™ audio technology

　　Qualcomm® aptX™ audio playback support: Qualcomm® aptX™, Qualcomm® aptX™ HD, Qualcomm® aptX™ Adaptive

　　Voice Services Support: Amazon Alexa Voice Service, Google Assistant

　　Qualcomm® Active Noise Cancelling (ANC) technology: Feedback, Feedforward

　　Qualcomm® cVc™ noise cancellation technology: 2-mic Headset, 2-mic Speaker, 1-mic Speaker, 1-mic Headset

　　Audio PlaybackChannel output: Stereo

　　Power ConsumptionAmperage: ~10mA HFP Narrow Band, 1 Digital MIC cVc, ~10mA, A2DP stream (SBC), measured at battery terminal, 3.7v including load

　　PackagePackage Type: BGA

　　Pins: 90 pins

　　Pitch: 0.5mm Pitch

　　Package Size: 5.5 x 5.5 x 1 mm