艾克尔科技公司(Amkor)和NANIUM S.A.昨(6)日联合宣布，双方已签署一项最终协议，艾克尔科技将收购世界一流的扇出型晶圆级(WLFO)半导体封装解决方案供应商NANIUM。双方尚未揭露交易条款。

晶圆级封装市场正快速成长，收购NANIUM将巩固艾克尔科技在智能手机、平板电脑和其他应用的晶圆级封装市场中的地位。NANIUM已研发出一项高产能、可靠的WLFO技术，并成功将该技术推向量产。迄今为止，NANIUM已利用最先进的300mm晶圆级封装(WLP)生产线实现近十亿的WLFO封装出货量。

艾克尔科技总裁兼执行长Steve Kelley表示：“这一策略性收购将巩固艾克尔科技作为领先的WLP和WLFO封装解决方案供应商的地位。凭借NANIUM成熟的技术，我们能够扩大该技术的生产规模和客户群。”

NANIUM执行董事会主席Armando Tavares说：“此项艾克尔交易非常适合我们，其为NANIUM及其员工的未来发展提供一个强大平台。艾克尔科技的技术领导地位、大量资源以及全球业务版图与NANIUM一流的WLFO封装解决方案相结合，将加快该技术的全球推广和发展。”

NANIUM总部位于葡萄牙波土，公司拥有约550名员工，截至2016年9月30日的会计年度，公司年销售额约为4000万美元。该项交易有待主管机关批准，并须满足一般成交条件，预计于2017年第一季完成。

艾克尔科技Amkor(AMKR)

艾克尔科技（或译作：安可电子公司or安靠技术）Amkor Technology, Inc.(NASDAQ:AMKR)创立于1968年，总部位于亚利桑那州坦佩，全职雇员21,900人，是全球最大的半导体封装和测试服务供货商（即将IPO的UTAC也是属于这个领域）。

全球最大半导体封装公司：艾克尔科技Amkor(AMKR)

艾克尔科技（安可技术）Amkor Technology美股百科：

Amkor Technology是全球最大的半导体封装和测试服务供货商，占全球半导体市场的30％份额，在全球多个国家设有工厂，如：中国、台湾、菲律宾、韩国、日本等，总部设在亚利桑那州坦佩，在加州、 波士顿、麻萨诸塞州、欧文、奥斯汀、德克萨斯、东京、新加坡、伦敦、台湾和法国等均有生产及销售代表处，主要服务于集成器件制造商、半导体公司、合同代工厂、通讯、消费电子、网络、计算、汽车和工业市场。

Amkor Technology半导体封装和测试技术方面居世界领先地位，除了承接半导体芯片测试业务外还销售芯片制造服务，顾客包括计划全部知名的半导体公司，如：拓朗半导体(NASDAQ:ALTR)、安华高科技(NASDAQ:AVGO)、Pte、飞思卡尔(NYSE:FSL)、英特尔(NASDAQ:INTC)、索尼半导体公司(SONY)以及东芝公司(Toshiba)等。

NANIUM

For over 20 years, NANIUM has provided advanced assembly and test services to a global customer base of semiconductor companies serving the consumer, communication, automotive, medical and computer industries.

We deliver creative, reliable and cost-efficient solutions, ranging from package design to prototyping, wafer-level packaging (WLP), wafer probe, assembly and test, supply-chain management and drop shipping.

With state-of-the-art equipment, including 300mm wafer-level packaging capabilities, we offer the industry’s most advanced fan-out/fan-in WLP, system-in-package (SiP) solutions and advanced 3D packaging, producing miniaturization and electrical performance at the lowest cost and fastest cycle times.

In 2015, NANIUM celebrated its 5th anniversary. Though apparently young, we have close to twenty years of expertise in the semiconductor industry since its inception in 1996 as Siemens Semiconductors. Initially focusing on leadframe-based and laminated-based packages like BGA and LGA, in 2010 the company became a service-provider in the 300mm Wafer-Level Packaging market. Nowadays, NANIUM stands as a leader in Fan-Out WLP/ eWLB, a technology that combines minimal form-factor with high integration density, superior electrical/thermal performance and maximum reliability.

Based in Portugal, NANIUM’s facilities include over 20,000 m2 of cleanroom area, making it the largest OSAT in Europe. The company offers in-house capabilities for the entire development chain, from design to the flexibility to tailor and test solutions that respond to the most demanding customer requirements. NANIUM is based in Vila do Conde, greater Porto area, and has sales offices in Dresden, Germany, and Boston, USA