东芝提供了针对手持式应用装置的各种需求. 如近距离无线传输技术TransferJetTM, 符合高效率快速的无线充电解决方案, Bluetooth及接口桥接芯片等. 可提供任何智能手机, 平板计算机及各种外围附件。

Smartphone/ Tablet 系统方框图

近距离无线传输技术TransferJet™ compliant IC

无线充电电源IC

BluetoothTM 系列整合型单芯片

接口桥接芯片

随着多媒体内容的分辨率和图像质量越来越高，在摄像机、液晶显示器等外围设备上高速接收或发送大量的资料变得在所难免，因为只有这样才能满足基带和应用处理器等主要处理器的工作需求。东芝推出了名为“移动外围器件(MPD)”的接口桥接芯片，可支持高速数据传输协议，比如 MIPI、LVDS、Display Port和HDMI。东芝的MPD不仅可以高速传输数据，也可以桥接主要的处理器和不同接口的外围设备。东芝也推出了广泛的外围设备产品组合，比如输入输出扩展器件和SC卡控制器等。

产品阵容

东芝的网桥和缓存器IC支持各种串行数据传输协议, 例如MIPI®, MDDI, LVDS, Display Port和HDMI, 便于设计手机及其他屏幕显示设备。

输入/输出扩展器IC可轻松增强现有系统的输入/输出能力，包括GPIO、键盘、LED控制器和定时器。该扩展器的应用领域非常广泛，涉及手机、数码相机、打印机等。

另外，东芝还正在开发各种主处理器周边辅助产品，如可以向SD卡高速传输数据的SD卡主机控制器等。

输入/输出接口组合

【TC35661】

Bluetooth® Single-Chip Controller for BT Classic (3.0+EDR) and Bluetooth Low Energy (4.0, 4.2)

Dual-Mode-BT-4_TC35661

The TC35661 series are highly integrated RFCMOS Bluetooth devices which support Bluetooth Classic (3.0+EDR) and Bluetooth Low Energy (LE) 4.0 and 4.2 standards. TC35661 supports the standard Bluetooth HCI interface and offers integration of stack and selected BT profiles on-chip. Through its WIFI coexistence interface it supports the BT3.0-HS function. The devices realise an easy way to integrate Bluetooth for various industrial, medical and automotive applications. Toshiba has tested the Bluetooth interoperability extensively. All Toshiba Bluetooth devices and software are Bluetooth Qualification Expert (BQE) qualified.

Toshiba Bluetooth® Silicon and Software Brochure (pdf 4.9MB)

Bluetooth Module with TC35661 Bluetooth LSI available

The Toshiba Bluetooth® LSI TC35661SBG has been embedded - including it's SPP & BLE-GATT profile - into the Panasonic (PIDEU) module PAN1026. It is FCC/IC/CE certified. The embedded stack and profile were Bluetooth™ SIG approved through extensive BQB (Bluetooth™ Qualification Body) tests. The module is ideal for for wireless serial applications and all kind of BLE connectivity. System developers can make use of the Serial Port Profile and hook on their selected BLE profile onto BLE-GATT through the comfortable Toshiba API interface over UART. Read more... (pdf)

TC35661 (FBGA64) Block Diagram

Key Benefits

Dual Mode core for classic and Bluetooth 4.0 and 4.2 standards

BQE qualified hardware and software for easy Bluetooth EPL

Flexible system architectures through:

HCI model

Embedded profile model

Stand alone model

Embedded on-chip Bluetooth stack and selected profiles for easy Bluetooth system design

Stand alone operation for small applications is feasible without a host MCU

Ultra low bill of materials due to very few external components

Multiple programmable IO options

On-chip voltage controller and low power modes

Consumer and automotive qualification (AEC-Q100)

TC35661 Line-up

Features

Bluetooth® Core Spec 3.0, 4.0 and 4.2, EDR and LE support

TC35661–0XX: HCI type

TC35661–XXX: embedded profile type

BT Class 2 support

RX Sensitivity –91dBm (typ.)

Baseband with ARM® CPU - 13 to 52 MHz

On–chip ROM, RAM, including Patch–RAM

On–chip balun, antenna switch, LNA, LDO

Interfaces: UART, SPI, USB2.0(FS), I2C, I2S/PCM, GPIO

IEEE802.15.2. 2/3/4 coexistence interface

Data transfer up to 2 Mbps (DH5 packets) net

Package: 64ball BGA (ROM version), 0.5/0.8mm pitch, 1.2/1.4mm height

Operational voltage: 1.8V or 3.3V (typ.)

Low power sleep mode 30uA (max)

Operation mode well below 30mA (depends on packet-type and selected operational mode)

AEC-Q100 automotive qualification on selected devices (0.8mm pitch)

TC35661 HCI System Concept

TC35661SBG-HCI-System-Concept

The Bluetooth® HCI (host controller interface) model: the low layer stack (RF, LC, LM) runs on the TC35661SBG device (ROM or external flash memory). Through a UART or USB it is connected to an external host processor, which executes the upper Blueooth® stack (L2CAP, RFCOMM) and profiles.

Beyond the upper stack the host processor runs the application software. This application processor may also run additional tasks such as middleware and multimedia functions. This concept is suitable for voice and data.

TC35661 Embedded Profile System Concept

TC35661SBG-HCI-Embedded-Profile-System-Concept

The Embedded Profile model integrates both the lower and upper stack as well as some selected profiles in the TC35661SBG (ROM or external flash memory). The UART interface carries the data of a higher layer API. The whole Bluetooth® functionaly is managed by the Bluetooth® LSI. The host processor only handles the application data. Depending on the complexity of the application the host CPU performance requirement can be very minor. This concept is for data only. The Embedded Profile models for BT4.0 features Smart Ready (dual mode) or Smart (BLE single mode) Bluetooth® marking.

TC35661 Stand Alone System Concept

TC35661SBG Stand Alone System Concept

TC35661 can be run without an additional host MCU for small applications. The application code gets stored into the attached EEPROM. After RESET the code is bootloaded into the embedded SRAM of TC35661-7xx/1xx and executed by the Bluetooth processor itself. This feature is available together with devices containing the Bluetooth stack with embedded SPP profile (-7xx) or HID profile (-1xx) in ROM. Toshiba uses commercial debugger software to allow evaluation of the application code.

【TC35667】

Bluetooth® Single-Chip Controller for Bluetooth Low Energy (4.0/4.1)

TC35667FTG_1000_MS

The TC35667 is a highly integrated RFCMOS Bluetooth device which supports the new BT Low Energy (LE) 4.0 and 4.1 standards. TC35667 is suitable for ultra low power portable products. The device comes with embedded BLE stack and GATT profile. Toshiba has tested the Bluetooth interoperability extensively and performed Bluetooth Qualification Expert (BQE) qualification.

Features

BLE 4.0 and 4.1 compliant

Supports BLE central and peripheral mode

RX Sensitivity -92dBm (typ.)

On-chip 32KB RAM for application code and patches

On-chip balun, antenna switch, LNA, DC-DC converter

Interfaces: UART, SPI & I2C interface, PWM output (3channels) , ADC (3 channels), 16 programmable IO

Operational Voltage: 1.8V to 3.6V

Deep sleep mode 0.7uA; sleep mode 5uA

Peak current in operation mode 0.9-5.9mA (depends on selected clock, voltage and communication mode)

Package: 40pin QFN 6mm x 6mm 0.5mm ball pitch or 5mm x 5mm 0.4mm ball pitch, height 0.9mm, or CSP

Key Benefits

Bluetooth® Low Energy (LE) 4.0 and 4.1 for power sensitive applications

Flexible system architectures through:

HCI model over UART

Embedded profile model (API over host UART)

Stand alone model (with embedded stack and profile)

Bluetooth® qualified embedded BLE stack and GATT profile for easy BQB EPL

On-chip RAM for slow to medium size applications

Ultra low bill of materials due to very few external components

System integration by multiple on-chip peripherals

Supports over-the-air (OTA) update of system software

Flexible single power supply (1.8V-3.6V)

Various sleep modes and clock options to optimize power consumption

Small and cheap system design with QFN40 package and CSP package

TC35667FTG Block Diagram

Stand Alone Application Example

【TC35670】

Bluetooth® Single-Chip Controller for Bluetooth Low Energy (4.1) + NFC Tag

The TC35670 combo device supports the new BT Low Energy (LE) 4.1 standard and includes an NFC Forum compliant Tag Class 3. The NFC Tag can wake up the BLE device from sleep mode through the NFC antenna and initiate easy Bluetooth pairing after confirmation of the BT device address. This connection setup enables ease of use and a very long battery life. TC35670 is ideal for ultra low power portable products and comes with embedded BLE stack and GATT profile. Toshiba Bluetooth® Silicon and Software Brochure (pdf 4.9MB)

Key Benefits

TC35670 Bluetooth LE (4.0) + NFC Tag

Shorten BLE host active period to further lower power to near 0

Bluetooth Low Energy (LE) 4.1 compliant

Flexible system architectures through:

Embedded profile model (API over host UART)

Stand alone model (with embedded stack and profile)

Low power NFC Tag function

Compliant with NFC Forum Tag Class 3 for easy pairing initialization and transfer of small amounts of data (ISO/IEC18092)

Supports wake up with 0 standby: when a remote device requests communication establishment the Tag block makes a wake up signal without host control and local battery consumption

On-chip EEPROM to store and transfer NFC data without host control

Bluetooth qualified embedded BLE stack and GATT profile for easy Bluetooth SIG EPL

On-chip RAM for simple to medium size application code and data

Supports over-the-air (OTA) update of system software

Ultra low bill of materials due to very few external components

System integration by various on-chip peripherals

Flexible single power supply (1.8V-3.6V)

Various sleep modes and clock options to optimize power consumption

Small and cheap system design with QFN40 package: 6mm x 6mm

TC35670 Features

BLE 4.1 compliant

Supports BLE central and peripheral mode

BLE peak power consumption: 5.9mA (depends on selected clocking scheme and data mode)

RX Sensitivity -92dBm

On-chip 32KB RAM for application code, data patches

On-chip 1.5KB EEPROM

On-chip balun, antenna switch, LNA, DC-DC converter

Interfaces: UART (2), SPI & I2C interface, PWM output (3channels), ADC (4 channels), 9 programmable IO

Operational Voltage: 1.8V to 3.6V

Deep sleep mode 0.1uA; sleep mode 5uA

Tag Operational Mode: 600uA

Peak current in operation mode 5.9mA Package: 40pin QFN 6mm x 6mm x 0.5mm

Block Diagram