原标题：Infineon EconoPACK-4 650V IGBT4-E4评估方案

　　infineon公司的EconoPACK™ 4是AC和DC连接隔离的IGBT,电流范围从100A到400A,电压650V和1200V,具有可靠性高,容易安装和高效率等特色,主要用在通用驱动器,伺服驱动, 可再生能源,UPS和空调等.本文介绍了EconoPACK™ 4主要特性,优势,以及评估板F3L2020E12-F-P_EVAL主要特性,电路图,材料清单和PCB设计图.

　　The EconoPACK™ 4 package perfectly fits into the well-known Econo portfolio. EconoPACK™ 4 features a screw power terminal, providing an excellent electrical connection. The DC and AC links are separated and distinguishable at a glance for ease of use. Control pins feature our PressFIT technology for solderless assembly. A new and highly reliable ultrasonic welding process is used for all connections between the terminals and the DCBs within the module.

　　Optimized gate driver connection is possible by placing the driver on top of the module. Low parasitic stray inductance and optimized thermal resistance to heat sink support to excellent inverter solutions.

　　The EconoPACK™ 4 portfolio is available in current ratings from 100 A up to 400 A. 6-pack and half-controlled input rectifier configurations (available in 1600 V with current ratings of 240 A and 360 A) are tailor-made for industrial applications.

　　Furthermore, 3-level single-phase solutions are available with the 650 V and 1200 V IGBT technology and current ratings of 200 A to 400 A, offering higher efficiencies, lower switching losses as well as savings in system costs.

　　All IGBTs and diodes support junction temperatures of Tvjop = 150℃ and improved power cycling capabilities.

　　Hence, the IGBT module family EconoPACK™ 4 helps users design powerful and compact inverters at optimized system costs. All IGBT modules are additionally equipped with an NTC for temperature measurement. This highly integrated solution is even available with integrated driver circuitry – MIPAQ™ serve.

　　EconoPACK™ 4主要特性:

　　Robustness: rugged mechanical design with ultrasonic welded and injection-molded terminals

　　Easy and ultra-reliable assembly: PressFit control pins and screw power terminals for completely solderless connections

　　Efficiency: leading IGBT technologies with increased Tvjop = 150 ℃, optimized module layout for high power densities

　　Integration: compact rectifier, 6-pack and 3-level single-phase configurations with NTC

　　EconoPACK™ 4应用:

　　General-purpose drives

　　Servo drives

　　Renewable energy systems

　　Uninterruptible power supplies

　　Air conditioning

　　And many more

　　IGBT Modules up to 600V/650V High Power IGBT Modules available in different topologies with current ratings from 6 A to 600A.

　　The new 650V IGBT4-E4 is an optimized chip version designed with respect to the application needs. The new device features an improved softness during switch-off and as a result of the soft turn-off a reduced EMI effort. A lower overshoot voltage as the result of a reduced turn-off current slope, di/dt, in combination with a 50V higher blocking capability, VCES=650V, provides a significant advantage for the application. The high short circuit capability, tp=10μs, comes as a real surplus for a robust design.

　　650V IGBT4-E4模块:

　　Compact lower power module with a height of 17mm

　　10µs short circuit 1 robustness at 150℃

　　650V collector-emitter voltage (best in class)

　　Higher margin for over voltage

　　Operating temperature up to 150℃

　　Higher power cycling capability

　　Soft switching characteristic

　　1,55V Collector-emitter saturation voltage (better than competition)

　　Low switching losses (better than competition)

　　Solder and PressFIT mounting technology (first vendor)

　　Optimized heat spreading

　　Low stray inductance < 21nH for sixpack configuration

　　Integrated temperature sensor (NTC)

　　RoHS-compliant

　　650V IGBT4-E4模块主要优势:

　　IGBT4 chip technology

　　1,55V Collector-emitter saturation voltage (better than competition)

　　Lower switching losses than competition

　　10µs short circuit 1 robustness at 150℃

　　More cost optimised driver stage feasible

　　Softer switching characteristic

　　650V IGBT4-E4模块应用:

　　Industrial drives

　　Variable speed drives

　　Servo-drives

　　Air conditioning systems

　　Medical (e.g. X-Ray)

　　评估板F3L2020E12-F-P_EVAL

　　Evaluation Driver Board for EconoPACKTM4 3-Level Modules

　　The evaluation driver board F3L2020E12-F-P_EVAL for 3-level NPC2 EconoPACKTM 4 modules as shown in Figure 1 was developed to support customers during their first steps designing applications with EconoPACKTM 4 3-level NPC2 modules. This evaluation board was designed in addition to the module adapter board MA3L120E12_EVAL 1 or could be a complementary part for an existing customer driver solution.

　　The board is available from Infineon in small quantities. The properties of this board are described in the design feature chapter of this document, whereas the remaining paragraphs provide information to enable the customers to copy, modify and qualify the design for production, according to their own specific requirements.

　　Environmental conditions were considered in the design of the F3L2020E12-F-P_EVAL. Components qualified for a lead-free reflow soldering process were selected. The design was tested as described in this document but not qualified regarding manufacturing and operation over the whole operating temperature range or lifetime.

　　The boards provided by Infineon are subject to functional testing only. Due to their purpose evaluation boards are not subject to the same procedures regarding Returned Material Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD) as regular products.

　　图1. 评估板F3L2020E12-F-P_EVAL外形图

　　Evaluation driver board F3L2020E12-F-P_EVAL, adapter board and EconoPACKTM 4 3-level module as evaluation kit

　　The board operates as single module driver or as main driver for up to three IGBT modules in parallel configuration. The evaluation board is developed to operate in combination with the MA3L120E12_EVAL2 evaluation adapter board mounted in conjunction with a 3-level NPC2 EconoPACKTM 4 module. The F3L2020E12-F-P_EVAL driver board provides

　　- Functional isolation between logic and power side utilizing Coreless Transformer Technology

　　- Short circuit protection and Under Voltage Lock Out (UVLO)

　　- Active clamping

　　- Bipolar power supply of the driver‟s secondary side with +15V/-8V

　　- Positive or negative input logic with 5 V CMOS level for PWM

　　- RDY and /FLT output status signals

　　图2. 评估板F3L2020E12-F-P_EVAL主要元件分布图(顶层)

　　图3. 评估板F3L2020E12-F-P_EVAL主要元件分布图(底层)

　　图4. 高边和低边IGBT驱动电路

　　图5. 内部左边和右边IGBT驱动电路

　　评估板F3L2020E12-F-P_EVAL材料清单: