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基于Microchip IS2064B的TWS蓝牙耳机解决方案

来源: 大大通
2019-01-15
类别:便携设备
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文章创建人 拍明

原标题:基于Microchip IS2064B的TWS 蓝牙耳机方案

  

  TWS无线立体耳机有望成为下一个快速普及的智能消费产品。以AirPods,Bragi为代表的苹果,三星等标志性的产品引领TWS耳机消费趋势;移除3.5mm耳机趋势已成,无线耳机便捷度智能化优势大,成为消费者的重要选择。

  Microchip 顺应市场需求,推出IS2064B ,它是一ROM 版的立體聲SOC藍牙解決方案,是一款同时支持音频,数据传输,BLE 三模的方案,低成本,高品质,开发周期短,可满足客户迅速产品化要求。

  场景应用图

场景应用图.png

  产品实体图

产品实体图.png

  展示板照片

展示板照片.png

  方案方块图

方案方块图.png

  产品拆解图

产品拆解图.png

  核心技术优势

  支持以下Bluetooth profiles,

  1. A2DP1.3

  2. AVCRP1.6

  3. HFP1.6

  4. HSP1.6

  5. SPP1.2

  方案规格

  1. 内置电池管理功能,最大充电电流350mA。

  2. 内容电池电压、温度检测。

  3. 支持ANCS。

  4. 内置高质量的DAC转换电路:信噪比98dB。

  5. 小封装尺寸:5X5X0.9 ;3.5X5X0.9。

  6. 蓝牙版本:Bluetooth V4.2,极高的软件兼容性。

  7. 极低的功耗: 听音乐平均功耗17mA

  8. 射频支持Class1、2功率级别,最大15 dBm。

  9. 高品质音频: 内置32-Bit DSP,16Khz NC&EC

  10. 支持双向控制,APP 2 Headset; SPK 2 App 。

  11. 多音频格式解码功能: SBC、AAC 、mSBC。

  技术文档

类别标题档案
硬件PCB

5082_PCB.zip

硬件Schematics

5082_sch.zip

  【IS2064】

  Features:

  Codec support for SBC, AAC, and LDAC (IS2064GM-0L3 only)

  Bluetooth 5 Certified

  Portable Speakers

  Multiple Speaker Support

  Device Overview

IS2064.png


  Summary

  The IS2064 products are part of our Bluetooth Dual Mode family of stereo audio SoCs. Three variants are offered in a variety of packages, form factors and memory configurations. The IS2064GM is a Flash-based device that can be programmed to support a variety of speaker configurations. The IS2064S/B are ROM-based devices featuring Stereo Mode functionality, which allows audio playback on two devices.

  All variants support SBC and AAC Codecs. The IS2064GM-0L3 supports LDAC. For more information contact your local Microchip representative or send an email to BTAudio@microchip.com.

  Additional Features

  Bluetooth Features

  Codec support for SBC, AAC, and LDAC (IS2064GM-0L3 only)

  Bluetooth 5 Certified

  Support to simultaneously connect to two audio sources via HFP and/or A2DP

  Generic Access Service

  Device Information Service

  Proprietary Services for data communication

  HFP 1.6

  HSP 1.2

  A2DP 1.3

  SPP 1.2

  AVRCP 1.6

  System Features

  Built-in internal Flash for program memory (IS2064GM)

  16 MHz main clock input

  USB firmware upgrade supported

  Three LED drivers

  Built-in EEPROM

  Integrated 3V, 1.8V configurable switching regulator and LDO

  Crystal oscillator with built-in digital trimming for temperature/process variations

  Built-in ADC for battery monitor and voltage sense

  Built-in Lithium-ion battery charger (up to 350mA)

  RF Features

  Adaptive Frequency Hopping (AFH) avoids occupied RF channels

  Fully supports Bluetooth BDR/EDR/BLE specification

  Combined TX/RX RF terminal simplifies external matching and reduces external antenna switches

  Maximum +4 dBm output power

  Built-in T/R switch for Class 2/3 application

  There requires no external VCO, varactor diode, resonator and loop filter

  Supports 64 kb/s A-Law or µ-Law PCM format, or CVSD (Continuous Variable Slope Delta Modulation) for SCO channel operation.

  Audio Features

  Fully integrated synthesizer

  Noise suppression

  Echo suppression

  SBC and optional AAC decoding

  Packet loss concealment

  Supports SCMS-T

  20 bit DAC and 16 bit ADC codec

  98dB SNR DAC playback

  Supports digital audio I2S format and analog audio output

  A line-in port for external audio input

  High speed HCI-UART (Universal Asynchronous Receiver Transmitter) interface(up to 921600bps)

  Applications

  Headsets

  Headphones

  Portable Speakers

  Multiple Speaker Support

  Parametrics

  Name:Value

  Bluetooth Classic-Data/SPP:Yes

  Bluetooth Classic-Audio:Yes

  Bluetooth Low Energy:Yes

  Audio Channels:Stereo

  Analog Audio Out:Yes

  Digital Audio Out:Yes

  MIC-in:1

  Line-in:Yes

  GPIO:15

  Package Type:68-pin LGA, 68-pin QFN, 61-pin BGA:Package Size

  8x8 LGA, 8x8 QFN, 5x5 BGA

  Temperature Range:-20 C to +70 C

  Operating Voltage Range:3.2 V to 4.2 V


责任编辑:David

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